Vertically Integrated Electronic Circuits via a Combination of Self-Assembled Polyelectrolytes, Ink-Jet Printing, and Electroless Metal Plating Processes

Guo, Tzung Fang; Chang, Shu Chen; Pyo, Seungmoon; Yang, Yang

doi:10.1021/la0257889

Cited by 59 publications

(64 citation statements)

References 31 publications

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…Since Decher and his co-workers [27,28] first put forward this method, referred to as self-assembly in most references, [29][30][31][32][33][34] it has been widely applied in recent years in a variety of fields, including biofield, [35,36] charged particles, [37][38][39] thin metal films, [40][41][42] etc. But generally, the factors that influence the film's formation are still not fully understood.…”

Section: Self-assembled Polyelectrolytes and Ink-jet Printing And Thementioning

confidence: 99%

“…[51][52][53] In fact, some polyelectrolyte solutions have physical properties similar to that of pure water, like PAA and PAH, and are suitable to dispense by the ink-jet method. [41] This characteristic creates the possibility of modifying the local surface on a substrate by image pattern definition and avoiding the dip step to deform the substrate. In particular, Shan et al [42] has performed a pioneering work on the inkjet printing of catalyst and the formation of a metal circuit by an electroless plating method.…”

Section: Self-assembled Polyelectrolytes and Ink-jet Printing And Thementioning

confidence: 99%

See 1 more Smart Citation

Ink‐Jet Printing, Self‐Assembled Polyelectrolytes, and Electroless Plating: Low Cost Fabrication of Circuits on a Flexible Substrate at Room Temperature

Cheng¹,

Mo-hua²,

Chiu³

et al. 2005

Macromol. Rapid Commun.

173

View full text Add to dashboard Cite

Summary: The driving forces behind the development of flexible electronics are their flexibility, lightweightedness, and potential for low‐cost manufacturing. However, because of physical limitations, traditional thermal processes cause deformations in the flexible substrate. As a result, the adhesion quality of the printed wires is deteriorated. This article reviews recent developments in printing circuits on a flexible substrate by combining self‐assembled polyelectrolytes, ink‐jet printing of a catalyst, and electroless plating of metals. The limitations and potential applications of this technology are also discussed. Experiments implementing this technology demonstrated significant results. By a vibration‐induced assistance during an ink‐jet printing catalyst process, line width and blurring can be controlled to within ±3% variation. Following the IPC 6013 standard for flexible electronics, the results after thermal cycling (288 °C, 6 times) and a hot oil test (260 °C, 3 times) indicated that the metallic circuit had retained excellent adhesion properties and electric characteristics. We also report the first successful demonstration of a metal film in a via‐hole inner wall on a flexible substrate. This novel fabrication method is ideal for the realization of large area, flexible electronics and future multilayer flexible substrate application, such as flexible display, chip on flexible substrate, etc., particularly where traditional lithographic processes can not be applied.Flexible high‐density circuit on an FR‐4 substrate (left) and picture of via hole with copper inner wall (right).magnified imageFlexible high‐density circuit on an FR‐4 substrate (left) and picture of via hole with copper inner wall (right).

show abstract

Section: Self-assembled Polyelectrolytes and Ink-jet Printing And Thementioning

confidence: 99%

Section: Self-assembled Polyelectrolytes and Ink-jet Printing And Thementioning

confidence: 99%

Ink‐Jet Printing, Self‐Assembled Polyelectrolytes, and Electroless Plating: Low Cost Fabrication of Circuits on a Flexible Substrate at Room Temperature

Cheng¹,

Mo-hua²,

Chiu³

et al. 2005

Macromol. Rapid Commun.

173

View full text Add to dashboard Cite

show abstract

“…[23][24][25][26][27] Such approaches utilize simple solution chemistry and could enable lowcost fabrication of metallized polymers with chemical diversity, allowing control over the degree of surface metallization. We have recently reported direct metallization of polyimide films that relies on chemical surface modification of polyimide to form cation exchangeable groups (i.e., carboxyl groups) and subsequent incorporation of metallic ions via an ion-exchange reaction followed by reduction of these incorporated metallic ions.…”

Section: Introductionmentioning

confidence: 99%

Copper/Polyimide Heterojunctions: Controlling Interfacial Structures Through an Additive‐Based, All‐Wet Chemical Process Using Ion‐Doped Precursors

Ikeda

Yanagimoto

Akamatsu

et al. 2007

Adv Funct Materials

View full text Add to dashboard Cite

Heterojunctions comprising copper thin films and polyimide underlayers are exploited as an important system for generating flexible microelectronic circuit elements. A fully additive‐based chemical method that allows metallization of polyimide films with copper by the in situ reduction of copper ions doped in surface‐modified polyimide precursors is reported. It is shown that dimethylamine borane is a good reducing agent for copper ions initially complexed with carboxylate anions in the hydrolyzed polyimide layers. This reduction allows diffusion of copper ions towards the film surface to form copper thin films, and simultaneously controls the fabrication of interfacial microstructures between the copper and underlying polyimide. The formation of copper thin films and composite layers is elucidated by glow‐discharge optical emission spectrometry depth profiling, scanning electron microscopy, and cross‐sectional transmission electron microscopy studies, and it is shown that the final microstructure at the copper/polyimide interface is dependent upon experimental variables: a larger amount of copper ions incorporated into the modified layers and a higher reduction rate result in the formation of a granular layer containing smaller copper nanoparticles near the film surface. The granular layers thus formed are found to play a critical role in achieving strong adhesion between metal thin films and the substrate, owing to the increased contact area and hence the increased work of adhesion between them. These results have important implications for realizing a novel adhesion scheme between deposited metals and underlying dielectrics based on nanoscale interlocking through metal nanoparticles.

show abstract

“…It is an autocatalytic redox process in which metal cations in solution are chemically reduced and deposited on the surface. [47][48][49][50][51][52][53][54][55][56] Recently, another form of electroless deposition (self-assembly of colloidal metal particles), has also generated interest for the fabrication of metal films and nanostructures. 57,58 This approach has been used to generate thin films of gold, platinum, and silver on different substrates.…”

Section: Introductionmentioning

confidence: 99%

Tethered Lipid Bilayers on Electrolessly Deposited Gold for Bioelectronic Applications

et al. 2006

View full text Add to dashboard Cite

This paper presents the formation of a novel biomimetic interface consisting of an electrolessly deposited gold film overlaid with a tethered bilayer lipid membrane (tBLM). Self-assembly of colloidal gold particles was used to create an electrolessly deposited gold film on a glass slide. The properties of the film were characterized using field-effect scanning electron microscopy, energy dispersive spectroscopy, and atomic force microscopy. Bilayer lipid membranes were then tethered to the gold film by first depositing an inner molecular leaflet using a mixture of 1,2-dipalmitoyl-sn-glycero-3-phosphoethanolamine-N-[3-(2-pyridyldithio)propionate], 1,2-di-O-phytanyl-snglycero-3-phosphoethanolamine (DPGP), and cystamine in ethanol onto a freshly prepared electrolessly deposited gold surface. The outer leaflet was then formed by the fusion of liposomes made from DPGP or 1,2-dioleoylsn-glycero-3-phosphocholine on the inner leaflet. To provide functionality, two membrane biomolecules were also incorporated into the tBLMs: the ionophore valinomycin and a segment of neuropathy target esterase containing the esterase domain. Electrochemical impedance spectroscopy, UV/visible spectroscopy, and fluorescence recovery after pattern photobleaching were used to characterize the resulting biomimetic interfaces and confirm the biomolecule activity of the membrane. Microcontact printing was used to form arrays of electrolessly deposited gold patterns on glass slides. Subsequent deposition of lipids yielded arrays of tBLMs. This approach can be extended to form functional biomimetic interfaces on a wide range of inexpensive materials, including plastics. Potential applications include high-throughput screening of drugs and chemicals that interact with cell membranes and for probing, and possibly controlling, interactions between living cells and synthetic membranes. In addition, the gold electrode provides the possibility of electrochemical applications, including biocatalysis, bio-fuel cells, and biosensors.

show abstract

Vertically Integrated Electronic Circuits via a Combination of Self-Assembled Polyelectrolytes, Ink-Jet Printing, and Electroless Metal Plating Processes

Cited by 59 publications

References 31 publications

Ink‐Jet Printing, Self‐Assembled Polyelectrolytes, and Electroless Plating: Low Cost Fabrication of Circuits on a Flexible Substrate at Room Temperature

Ink‐Jet Printing, Self‐Assembled Polyelectrolytes, and Electroless Plating: Low Cost Fabrication of Circuits on a Flexible Substrate at Room Temperature

Copper/Polyimide Heterojunctions: Controlling Interfacial Structures Through an Additive‐Based, All‐Wet Chemical Process Using Ion‐Doped Precursors

Tethered Lipid Bilayers on Electrolessly Deposited Gold for Bioelectronic Applications

Contact Info

Product

Resources

About