2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) 2016
DOI: 10.1109/isemc.2016.7571665
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Via pattern design and optimization for differential signaling 25Gbps and above

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Cited by 10 publications
(1 citation statement)
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“…Various studies to improve digital transmission speed have been conducted by optimizing via parameters such as the via diameter, via gap, via pad diameter, and ground aperture diameter to control the impedance discontinuity in the via structures [9,10], and by minimizing signal reflection and radiation through adding ground vias or adopting various ground via patterns [11][12][13]. Research has also focused on a new DL-based via structure with a flat-faced design as an alternative to optimizing the cylindrical via structures in DLs [14].…”
Section: Introductionmentioning
confidence: 99%
“…Various studies to improve digital transmission speed have been conducted by optimizing via parameters such as the via diameter, via gap, via pad diameter, and ground aperture diameter to control the impedance discontinuity in the via structures [9,10], and by minimizing signal reflection and radiation through adding ground vias or adopting various ground via patterns [11][12][13]. Research has also focused on a new DL-based via structure with a flat-faced design as an alternative to optimizing the cylindrical via structures in DLs [14].…”
Section: Introductionmentioning
confidence: 99%