Vibration-induced fatigue life estimation of ball grid array packaging

Abstract

Vibration loading has become very important in the reliability assessment of modern electronic systems. The objective of this paper is to develop a rapid assessment methodology that can determine the solder joint fatigue life of ball grid array (BGA) and chip scale packages (CSP) under vibration loading. The current challenge is how to execute the vibration fatigue life analysis rapidly and accurately. The approach in this paper will involve global (entire printed wiring board (PWB)) and local (particular component of interest) modeling approaches. In the global model approach, the vibration response of the PWB will be determined. This global model will give us the response of the PWB at specific component locations of interest. This response is then fed into a local stress analysis for accurate assessment of the critical stresses in the solder joints of interest. The stresses are then fed into a fatigue damage model to predict the life. The goal is to retain as much accuracy and physical insight as possible while retaining computation efficiency.

Fatigue life prediction for CBGA under random vibration loading by finite element method

“…The rst term of this equation is Basquin's law for high cycle fatigue and the second term is the Cof n-Manson's law for low cycle fatigue [9]. Under high frequency or short time loading, such as vibration loading, dropping test and cyclic bending et al the change speed of loading should be fast enough to have no effect on deformation which due to plastic strain [10,11]. So the plastic strain in Eq.…”

Feature extraction for latent fault detection and failure modes classification of board-level package under vibration loadings

“…Gu et al [5] calculated the solder joint damage accumulation under vibration loading by measuring the PCB board strain response with strain gauges on the back of it and predicted the remaining life based on Miner's rule. Wu [6] conducted a true stress analysis to improve the efficiency of current CACALE model. The stresses of the critical solder joints were fed into a fatigue damage model to predict the life.…”

Effect of solder pads on the fatigue life of FBGA memory modules under harmonic excitation by using a global–local modeling technique

“…Zhu et al [4] also studied the solder joint reliability in a printed wiring board assembly under bending by using the global-local modeling technique. Wu [5] utilized the global-local modeling concept to calculate the von Mises stress in solder joints of interest under random vibration loading and then predicted the fatigue life of solder joints using a damage model called the Basquin power-law relation. Che [7] assessed the random vibration durability of packages including, Ceramic Interposer Grid Array, Plastic Leaded Chip Carrier and FBGA components.…”