Virtual prototyping and qualification of board level assembly

On the difference between thermal cycling and thermal shock testing for board level reliability of soldered interconnections

“…By means of the empirical Coffin-Manson relation the number of cycles to failure from the accelerated test is converted to the expected number of cycles to failure under user's conditions. Further, finite element analysis (FEA) is commonly used in combination with experiments to assist in explaining the reason for failure of products, and where and under which conditions high stresses occur [1][2][3][4]. FEA is instrumental in predicting stresses in configurations after design changes and under different test conditions, and thus it is a tool used for design optimization.…”

Simulation-Based Design Optimization of Solder Joint Reliability of Wafer Level Copper Column Interconnects

“…In solder joint thermo-mechanical reliability design, many researchers have applied a simulation-based design optimization approach, based on design of experiments (DoE), surrogate modeling, numerical optimization technique and computer simulation, to optimize the solder joint fatigue life by finding the optimal or near-optimal set of design parameters [1][2][3][4][5][6][7][8][9][10][11][12][13]. A typical flow chart for the solder joint thermomechanical reliability design using simulation-based design optimization approach is shown in Figure 2 In this study, the problem is solder joint fatigue failure and the objective is to find an optimal set of design parameters to maximize solder joint fatigue life.…”

“…In the realm of electronic packaging, various researchers have used different DoE methods to sample the design space (Mertol [1][2][3], Dasgupta et al [4], Zhang et al [5], Vandevelde et al [6] [7], Driel et al [8] [9], Stoyanov et al [10], Jagakal and his colleagues [11], Yang et al [12], Lee et al [13]). From the above literature survey, it seems that the full factorial, orthogonal array and Latin Hypercube methods are the most popular.…”