2015
DOI: 10.1109/jphotov.2015.2400212
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Wafer-Bonded GaInP/GaAs//Si Solar Cells With 30% Efficiency Under Concentrated Sunlight

Abstract: Highly efficient III-V/Si triple-junction solar cells were realized by a fabrication process based on direct wafer bonding: Ga 0 .51 In 0 .49 P/GaAs dual-junction solar cells were grown inverted by metal organic vapor phase epitaxy on GaAs substrates and bonded to separately fabricated Si solar cells. The fast atom beam activated direct wafer bond between highly doped n-Si and n-GaAs enabled a transparent and electrically conductive interface. Challenges arising from the different thermal expansion coefficient… Show more

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Cited by 88 publications
(48 citation statements)
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“…Elsewhere, we have the electron collector consisting of an a-Si:H(i)/Si:H(n)/Si:H(p) triple layer stack, which features an interband silicon tunnel junction (TJ) at the Si:H(n)/Si:H(p) interface. Notably, TJs are already successfully used in a variety of monolithic multi-junction solar cells [37][38][39][40][41][42] , and in our application we capitalize on this prior knowledge. The specific thin-film material requirements to achieve efficient interband-tunnelling passivating contacts for electrons are discussed in detail in the following section.…”
mentioning
confidence: 99%
“…Elsewhere, we have the electron collector consisting of an a-Si:H(i)/Si:H(n)/Si:H(p) triple layer stack, which features an interband silicon tunnel junction (TJ) at the Si:H(n)/Si:H(p) interface. Notably, TJs are already successfully used in a variety of monolithic multi-junction solar cells [37][38][39][40][41][42] , and in our application we capitalize on this prior knowledge. The specific thin-film material requirements to achieve efficient interband-tunnelling passivating contacts for electrons are discussed in detail in the following section.…”
mentioning
confidence: 99%
“…This may be the case for perovskite on silicon [22] and also for III/V-cells on silicon, when wafer bonding or epitaxial growth is involved [18][19][20]. Therefore, the planar solar cell with sphere grating rear side presented in Section 3.3 could be a suitable bottom cell for such tandem structures.…”
Section: Estimates For Si-based Tandem Devicesmentioning
confidence: 99%
“…For a performance estimate of a III/V-silicon tandem device we refer to the recently published work of Essig et al [18]. They fabricated a triple junction device consisting of a GaInP/GaAs dual junction top cell that was wafer bonded onto a 280 mm thick silicon bottom cell.…”
Section: Iii/v On Siliconmentioning
confidence: 99%
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