Wafer-level calibration of large-scale integrated optical phased arrays

Guerber, Sylvain; Fowler, Daivid; Faugier-Tovar, Jonathan; CARIM, KIM ABDOUL; Delplanque, Baptiste; Szelag, Bertrand

doi:10.1364/oe.464540

Cited by 14 publications

(5 citation statements)

References 22 publications

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“…The characterization of the OPA was performed at the wafer-level as described in previous work 38 . This avoids chip dicing as well as complex packaging, which greatly facilitates the evaluation of multiple circuits.…”

Section: Resultsmentioning

confidence: 99%

Active optical phased array integrated within a micro-cantilever

Guerber,

Fowler,

Mollard

et al. 2024

Commun Eng

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Three dimensional sensing is essential in order that machines may operate in and interact with complex dynamic environments. Solid-state beam scanning devices are seen as being key to achieving required system specifications in terms of sensing range, resolution, refresh rate and cost. Integrated optical phased arrays fabricated on silicon wafers are a potential solution, but demonstrated devices with system-level performance currently rely on expensive widely tunable source lasers. Here, we combine silicon nitride photonics and micro-electromechanical system technologies, demonstrating the integration of an active photonic beam-steering circuit into a piezoelectric actuated micro cantilever. An optical phased array, operating at a wavelength of 905 nm, provides output beam scanning over a range of 17° in one dimension, while the inclination of the entire circuit and consequently the angle of the output beam in a second dimension can be independently modified over a range of up to 40° using the piezoelectric actuator.

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Section: Resultsmentioning

confidence: 99%

Active optical phased array integrated within a micro-cantilever

Guerber,

Fowler,

Mollard

et al. 2024

Commun Eng

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“…A module combining dedicated photonics and CMOS chips has validated coherent detection of the reflected light with extraction of speed and distance of the illuminated object. Specific test benches have been developed to characterize LiDAR functions at wafer level [2][3][4] and in open space [5]. The experimental results have validated the models.…”

Section: Running Developmentsmentioning

confidence: 98%

FMCW chip-scale LiDARs for safer and smarter mobility of people and goods

Simoens

Barrera²,

Colard³

et al. 2023

Smart Photonic and Optoelectronic Integrated Circuits 2023

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LiDAR sensors are key to ensure safety and efficiency of autonomous vehicles and mobile robotic systems. But current commercial LiDAR technologies cannot face the issues in terms of costs, reliability and form factors that are hindering widespread adoption. Steerlight, a CEA-Leti spin-off, develops a new generation of on-chip LiDARs that relies on Frequency Modulated Continuous Wave (FMCW) and Silicon Photonics. FMCW provides instantaneous depth and velocity acquisition while Silicon Photonics enables the integration of the optical and electronics functionalities on a single chip. This paper will first describe the proposed silicon photonics based architecture. Subsequently, various demonstrations will illustrate the roadmap towards miniature and scalable LiDARs. Such features will contribute to making a wide range of devices smarter and safer, beyond the automotive and robotics markets.

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“…The characterization of the OPA was performed at the wafer-level as described in previous work [35]. This avoids chip dicing as well as complex packaging which greatly facilitates the evaluation of multiple circuits.…”

Section: D Beam Scanning With Quasi-static Cantilever Operationmentioning

confidence: 99%

Active optical phased array integrated within a micro-cantilever

Fowler,

Guerber,

Mollard

et al. 2024

Preprint

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Using wafer level fabrication techniques, we combine silicon photonics and MEMS technologies to demonstrate the integration of an active photonic beam-steering circuit into a piezoelectric actuated micro cantilever. An optical phased array (OPA), operating at a wavelength of 905nm, provides output beam scanning over a range of 17° in one dimension, while the inclination of the entire circuit and consequently the angle of the output beam in a second dimension can be independently modified over a range of up to 40° via the piezoelectric actuator. This combination of existing commercial silicon technologies can provide continuous, low-divergence, solid-state beam scanning for sensing applications, while avoiding the disadvantages associated with the use of a widely tunable source laser.

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Wafer-level calibration of large-scale integrated optical phased arrays

Cited by 14 publications

References 22 publications

Active optical phased array integrated within a micro-cantilever

Active optical phased array integrated within a micro-cantilever

FMCW chip-scale LiDARs for safer and smarter mobility of people and goods

Active optical phased array integrated within a micro-cantilever

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