2008
DOI: 10.1016/j.apsusc.2008.05.233
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Wet chemical etching method for BST thin films annealed at high temperature

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Cited by 14 publications
(6 citation statements)
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“…However, it is challenge to utilize the BST bulk materials in the top-down process due to its fragility and low etching rate. 18 On the other hand, the bottom-up fabrication technique is preferred to the top-down technique because that deposition of thin film dielectric materials has been reported with successes. Among various thin film fabrication methods, [19][20][21][22] RF magnetron sputtering is favorable due to its ease of implementation, superior compositional reproducibility, controllability, good crystallinity, and desirable dielectric properties.…”
mentioning
confidence: 99%
“…However, it is challenge to utilize the BST bulk materials in the top-down process due to its fragility and low etching rate. 18 On the other hand, the bottom-up fabrication technique is preferred to the top-down technique because that deposition of thin film dielectric materials has been reported with successes. Among various thin film fabrication methods, [19][20][21][22] RF magnetron sputtering is favorable due to its ease of implementation, superior compositional reproducibility, controllability, good crystallinity, and desirable dielectric properties.…”
mentioning
confidence: 99%
“…Moreover, BHF is known to attack SiO2, which might be inconvenient when using Si substrates. In order to selectively etch the BST thin film and to control the etching rate, catalysis of the HF agent was proposed [8]. HF is a weak acid and hence is partially disassociated in solution [17]:…”
Section: Catalysis and Optimization Of The Etching Solutionmentioning
confidence: 99%
“…The etching rate has been controlled by dilution of the acids. Only few studies have already shown that buffered hydrofluoric acid (BHF) combined with an acid catalyst is an effective etching solution [8,9], the details of the ongoing chemical reactions, however, are not reported.…”
Section: Introductionmentioning
confidence: 99%
“…A peel-off process is used to create the metal pattern of the bottom electrode on the LaAlO 3 substrates. The Ba 0.4 Sr 0.6 TiO 3 (BST) film is grown (1000 nm) on the pre-patterned Pt/Ti/LaAlO 3 substrates, and then annealed at 800°C for 30 min in air, and then patterned using a kind of special etching solution for BST thin films annealed at high temperature [8]. Au/Ni-Cr metal stacks are evaporated as the top electrode by a novel two-cavity resistance evaporating equipment for preserving the good adhesion and overcoming the diffusion between Au layer and Ni-Cr layer to reduce the ohmic loss of the center signal transmission line.…”
Section: Device Fabricationmentioning
confidence: 99%