Wideband RF interconnects for organic chip packages comparison of single ended and differential transitions

Rohrl, Franz Xaver; Jakob, Johannes; Bogner, Werner; Hageneder, Daniel

doi:10.1109/eumc.2015.7345880

Cited by 5 publications

(1 citation statement)

References 1 publication

Supporting

Mentioning

Contrasting

Order By: Relevance

“…couplers or filters) can now be inexpensively and individually integrated into the PCB. By packaging with organic substrates, radio frequency (RF) chips for applications up to 67 GHz can be integrated in standard PCB substrates [1]. In addition to the PCB connector, the signal path on the PCB and the PCB-package transition, the connection of the chip itself pushes its limit.…”

Section: Introductionmentioning

confidence: 99%

Bare die connections via aerosol jet technology for millimeter wave applications

Rohrl

Jakob

Bogner

et al. 2019

Int. J. Microw. Wireless Technol.

Self Cite

View full text Add to dashboard Cite

This paper presents a comparison of chip connections using aerosol jet (AJ) and bond technology on low-cost printed circuit board (PCB) substrates. First, the behavior of the used gap filler material and the used silver ink for AJ technology on PCBs are characterized. In addition to comparing the radio frequency (RF) performance (DC to 67 GHz) of the two technologies, the mechanical stability is also compared. While the AJ technology transitions score above all for their RF performance and the lower requirements (surface finish, pad size, and adhesion) on the PCB, the bonding technology has clear advantages, especially with a different coefficient of thermal expansion values of the substrates to be connected. Finally, the measurement results of a complete package are shown, whereby the chip connection is realized once by means of AJ and once by bonding wires.

show abstract

Section: Introductionmentioning

confidence: 99%