Wire density in CAE analysis of high pin-count IC packages: Simulation and verification

Jong, Wen-Ren; Chen, Y.R.; Kuo, T.H.

doi:10.1016/j.icheatmasstransfer.2005.05.012

Cited by 20 publications

(6 citation statements)

References 2 publications

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“…The mould temperature is set as 175 °C and 0.3 m/s of inlet v elocity is applied during the process. Table 1 summarized the material properties of the EMCs that are considered in the current simulation [8], [10][11]. The simulation is performed on an Intel Core 2 Duo processor E7500, 2.93 GHz with 2 GB of RAM; it took around 12 hours for each case to complete 14,000 iterations in time steps of 0.001s [8].…”

Section: The Computational Domain and Boundary Conditionsmentioning

confidence: 99%

Plastic Ball Grid Array Encapsulation Process Simulation on Rheology Effect

2011

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Abstrak Rangkaian elektronik terpadu harus dikemas untuk perlindungan dari pengaruh lingkungan seperti temperatur, tekanan dan benturan. Makalah ini menyajikan analisa visualisasi aliran fluida pada proses pengemasan (encapsulation process) IntroductionThe EMC rheology properties play an important role during the encapsulation process. It is because the final physical properties of EMC and processing rely on it. Rheology is defined as the science of flow and deformation of matter [1]-[4]. The most common models of rheology are the Castro-Macosko model. It is especially used in thermoset polymer rheology [4].The effect of gaps between die top and mold cap surface and between adjacent dies on EMC rheology during stacked-chip scale packages (S-CSP) encapsulated was studied by Abdullah MK et al. [4]. Rheokinetic simulation of mold filling behavior, mold void and wire sweeping dependences of gate size was analyzed by Lee MW et al. [5].In the present study, the computational fluid dynamic (CFD) code FLUENT 6.3 [6] is used to analyze the effect of rheology on the flow behavior of the encapsulation process of PBGA. The three dimensional models are developed and analyzed by using finite volume method. Flow behavior of encapsulant is modeled by Castro-Macosko with curing kinetic model by using user

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Section: The Computational Domain and Boundary Conditionsmentioning

confidence: 99%

Plastic Ball Grid Array Encapsulation Process Simulation on Rheology Effect

2011

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“…Wire sweep and paddle shift phenomenon in encapsulation were solved using the integration of fluid solver FIDAP [13,14], C-MOLD [15], MOLDEX3D [16] with ABAQUS, and ANSYS (structural solver). However, the simulations of both fluid and structural were analyzed separately.…”

Section: Introductionmentioning

confidence: 99%

Thermal Fluid-Structure Interaction in the Effects of Pin-Through-Hole Diameter during Wave Soldering

Aziz

Abdullah

Khor

et al. 2014

Advances in Mechanical Engineering

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An effective simulation approach is introduced in this paper to study the thermal fluid-structure interaction (thermal FSI) on the effect of pin-through-hole (PTH) diameter on the wave soldering zone. A 3D single PTH connector and a printed circuit board model were constructed to investigate the capillary flow behavior when passing through molten solder (63SnPb37). In the analysis, the fluid solver FLUENT was used to solve and track the molten solder advancement using the volume of fluid technique. The structural solver ABAQUS was used to examine the von Mises stress and displacement of the PTH connector in the wave soldering process. Both solvers were coupled by MpCCI software. The effects of six different diameter ratios (0.1 < / < 0.97) were studied through a simulation modeling. The use of ratio / = 0.2 yielded a balanced filling profile and low thermal stress. Results revealed that filling level, temperature, and displacement exhibited polynomial behavior to / . Stress of pin varied quadratically with the / . The predicted molten solder profile was validated by experimental results. The simulation results are expected to provide better visualization and understanding of the wave soldering process by considering the aspects of thermal FSI.

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“…Modeling tools, such as PLICE-CAD [2], FORTRAN [7][8][9], FLUENT [4,10], C-MOLD [6,14], and Moldex3D [15], have been used for the continuous improvement of various types of IC packages. The commercial computer-aided engineering (CAE) and the finite elementbased software assist researchers in enhancing the deformation of wire bonding [16] and paddle shift [17,18] during the encapsulation process. Thus, the implementation of computational modeling in the microelectronic industry contributes to the better understanding of the encapsulation process and enhancement of IC packages.…”

Section: Introductionmentioning

confidence: 99%