2009
DOI: 10.1063/1.3089677
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Work function engineering in low-temperature metals

Abstract: Semiconductor devices require conducting electrodes with disparate work functions for their operation. Of recent interest are fluidic processing approaches for large-area devices, which present unique challenges in the identification of materials having disparate work functions but similar melting temperatures. Such materials may be engineered by alloying with low-melting temperature metals. As a demonstration, the work function of tin and four binary tin alloys is measured by ultraviolet photoemission spectro… Show more

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Cited by 40 publications
(27 citation statements)
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“…Samples were cleaned in situ by argon-ion sputtering. The observed contact potential for both metal electrodes is consistent with previous work function measurements (16) and the measured work function of the selenium semiconductor appears in the middle of its known bandgap, giving confidence that the surface is reasonably well prepared and representative of the device's electronic structure. Image analysis was performed with SPIP and Gwyddion.…”
Section: Methodssupporting
confidence: 76%
See 1 more Smart Citation
“…Samples were cleaned in situ by argon-ion sputtering. The observed contact potential for both metal electrodes is consistent with previous work function measurements (16) and the measured work function of the selenium semiconductor appears in the middle of its known bandgap, giving confidence that the surface is reasonably well prepared and representative of the device's electronic structure. Image analysis was performed with SPIP and Gwyddion.…”
Section: Methodssupporting
confidence: 76%
“…This is a surprising result because of the large work function difference between the semiconductor (15) and metals (16) and the fact that selenium is known to readily form rectifying barriers when contacted to metals in planar devices (17). Indeed in our own control experiments, thermally deposited selenium devices readily formed rectifying contacts, but until now all fiber devices behaved ohmically (see SI Text).…”
Section: Resultsmentioning
confidence: 95%
“…Various materials including metals [3], alloys [15,17,18], polymer [16], biomolecular films [19], have been investigated using the SKP technique. Particularly, the SKP method has been employed to explore the electronic behaviors associated with surface structures, e.g., surface adsorption/contamination, surface charge imaging, metastable state transformation, biochemical reaction, catalysis, corrosion, friction/wear as well as microcracks [8,[20][21][22]. For example, the relationship between the WF and the position, angle and orientation of microcracks was reported [3].…”
Section: Introductionmentioning
confidence: 98%
“…Baikie et al [10] have described a UHV calibration method using a Hg lamp as a UV light source and a low-˚ sample in a retarding field configuration to the KP tip. Previous studies of metals [11] and ITO [12] have been performed using a combination of vacuum UPS measurements (absolute ˚) and CPD. However, these studies involve separate UHV photoemission (PE) and ambient pressure CPD measurements.…”
Section: Introductionmentioning
confidence: 99%