This paper reports on the unipolar medium wavelength infrared (MWIR) InAs/GaSb/B-Al 0.2 Ga 0.8 Sb type-II superlattice (T2SL) nBn detector's photoelectrical performance. In our model, the heterojunction barrier-active region (absorber) was assumed to be decisive as the contributing dark current mechanism limiting nBn's detector performance. The voltage drop analysis on the nBn structure was introduced to estimate the bias drop on the heterojunction barrier-active region. It was assumed that the contact n + -barrier heterojunction's layer has an insignificant influence on the electrical properties of the detector. In addition, a bulk-based model with an effective band gap of T2SL material has been assumed in the device modeling. Both current-voltage (I-V) and differential resistance-area product RA(V,T), characteristics of nBn's detector were found to be dominated by diffusion and generation-recombination currents in the zero-bias and the low-bias regions. At medium values of reverse voltages, the dark current was mostly affected by trap-assisted tunneling, whereas the band-to-band tunneling revealed its contribution at high values of reverse bias (V > 0.7 V). The RA(V,T) characteristics' fitting procedure allowed estimation of both diffusion and generation-recombination lifetimes as well as the trap energy level temperature dependence within T2SL energy gap. It was predicted that at T = 77 K, the RA product and detectivity reached values of 1000 cm 2 and 4 × 10 11 cm Hz 1/2 W -1 , respectively. The corresponding values at room temperature were 0.01 cm 2 and D * = 5 × 10 8 cmHz 1/2 W −1 , respectively. Finally, InAs/GaSb/B-Al 0.2 Ga 0.8 Sb T2SLs nBn's state of the art was compared to the performance of InAs/GaSb T2SLs PIN photodiodes and the HgCdTe bulk photodiodes operated at near-room temperature. It was shown that the RA product of the MWIR T2SLs nBn detector has reached a comparable level with the state of the art of the HgCdTe bulk photodiodes.

The paper reports on the first experimental results of the mid-wave infrared (MWIR) HgCdTe barrier detectors operated at near-room temperatures and fabricated using metal organic chemical vapor deposition (MOCVD). SIMS profiles let to compare projected and obtained structures and reveals interdiffusion processes between the layers. Undesirable iodine diffusion from cap to the barrier increase the valance band offset and is the key item in limiting the performance of HgCdTe nBn detector. However, MOCVD technology with a wide range of composition and donor/acceptor doping and without post grown annealing might be successfully adopted for barrier device architectures.

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The authors report on advanced metalorganic chemical vapor deposition (MOCVD) grown HgCdTe device structure for an ambient temperature long wavelength infrared radiation (LWIR) detector application. MOCVD technology with a wide range of composition and donor/acceptor doping and without post grown annealing seems to be an excellent tool for HgCdTe heterostructure epitaxial growth structure. The N + /G/π /G/P + /G/n + (where G denotes graded interface region) HgCdTe photovoltaic device concept of a specific barrier bandgap architecture integrated with Auger-suppression is a good solution for high operating temperature (HOT) infrared detectors. Selected problems of photodiode designing are indicated. Theoretical modelling using APSYS platform supports design and better understanding of the carrier transport mechanism in the photodiode structures. SIMS profiles allowed comparing projected and obtained structures and revealed diffusion processes in the structures. The negative differential resistance, clearly visible on current-voltage characteristics, evidences for Auger-suppression due to exclusion and extraction phenomena. It is shown that the thickness and arsenic doping of the active region influence the reverse bias dark current minimum and the response time of LWIR HOT HgCdTe photodiodes. Reverse bias highly (up to 50 times) increases responsivity that could reach 6 A/W at 300 K.

The paper presents the method and results of low-frequency noise measurements of modern mid-wavelength infrared photodetectors. A type-II InAs/GaSb superlattice based detector with nBn barrier architecture is compared with a high operating temperature (HOT) heterojunction HgCdTe detector. All experiments were made in the range 1 Hz -10 kHz at various temperatures by using a transimpedance detection system, which is examined in detail. The power spectral density of the nBn's dark current noise includes Lorentzians with different time constants while the HgCdTe photodiode has more uniform 1/f -shaped spectra. For small bias, the low-frequency noise power spectra of both devices were found to scale linearly with bias voltage squared and were connected with the fluctuations of the leakage resistance. Leakage resistance noise defines the lower noise limit of a photodetector. Other dark current components give raise to the increase of low-frequency noise above this limit. For the same voltage biasing devices, the absolute noise power densities at 1 Hz in nBn are 1 to 2 orders of magnitude lower than in a MCT HgCdTe detector. In spite of this, low-frequency performance of the HgCdTe detector at ~ 230K is still better than that of InAs/GaSb superlattice nBn detector.