Microactuators are an essential component in microsystems or microdevices, and in applications that include artificial muscles, pumps, valves, or switchers. Liquid‐crystalline elastomers are a new class of actuator material in the field of microsystem technologies, which can be used in standard processes. This newly developed actuator provides new possibilities in microfluidics because of its dimensional changes activated by the increase in temperature.
SummaryA combination of a “top-down” approach (substrate-conformal imprint lithography) and two “bottom-up” approaches (dewetting and dealloying) enables fabrication of perfectly ordered 2-dimensional arrays of nanoporous gold nanoparticles. The dewetting of Au/Ag bilayers on the periodically prepatterned substrates leads to the interdiffusion of Au and Ag and the formation of an array of Au–Ag alloy nanoparticles. The array of alloy nanoparticles is transformed into an array of nanoporous gold nanoparticles by a following dealloying step. Large areas of this new type of material arrangement can be realized with this technique. In addition, this technique allows for the control of particle size, particle spacing, and ligament size (or pore size) by varying the period of the structure, total metal layer thickness, and the thickness ratio of the as-deposited bilayers.
Black silicon and its application as a new assembly method for silicon wafers at room temperature is presented. Needle-like structures on the surface after deep reactive ion etching with a length of 15–25 µm and 300–500 nm in diameter interlock with each other to form a bonding interface. After compression of two wafers at room temperature they generate retention forces up to 380 N cm−2 (3.8 MPa). If low contact forces are applied with partially interlocking of the needles, it is possible to generate a reversible Velcro®-like assembly. This new bonding process can be used for applications in the area of microfluidics with catalysts, microoptical or mechanical mountings or carrier wafer bonding in microelectronics.
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