In this paper, we focus on how to identify non-visual failures by way of electrical analysis because some special failures cannot be observed by SEM (scanning electron microscopy) or TEM (transmission electron microscopy) even when they are precisely located by other analytical instrumentation or are symptomatic of an authentic or single suspect. The methodology described here was developed to expand the capabilities of nano-probing via C-AFM (conductive atomic forced microscopy), which can acquire detailed electrical data, and combining the technique with reasoned simulation using various mathematic models emulating all of the significant failure characteristics. Finally, a case study is presented to verify that such defect modes can be identified even when general PFA (physical failure analysis) cannot be implemented for investigating non-visual failure mechanisms.

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This paper presents a judicious reasoning method by coupling passive voltage contrast (PVC) with scanning probe microscopy (SPM) for revealing particular invisible defect modes, which were imperceptible to observe and very difficult to identify by means of traditional physical failure analysis techniques. In order to certify this compound method, it is applied to an implant issue as a case study. Through solving this particular defect mode, whose exact failure position could not be determined even with the most sensitive PVC or high-resolution SPM current mapping, the procedures and contentions are illustrated further. The significance of the reasoning method is based on electrical characterization and differential analysis. By coupling PVC with SPM, the capability to identify tiny defects is not limited to just distinguishing leakage or high-resistance under contacts. PVC can detect abnormal N+ contacts due to improper implanting, and SPM can provide the precise electrical characteristics.

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