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This research studied about an effect of epoxy molding compound material and roughness leadframe of integrated circuit package for automotive device. In manufacturing process, the epoxy molding compound material and leadframe roughness are main factors that effect to coefficient of thermal expansion (CTE) and reliability for automotive device package with no delamination in high temperature application. In experiment, two types of epoxy molding compound materials were studied and compared between standard and roughened leadframe for quad flat non lead (QFN) package. For reliability test, the epoxy molding compound materials type A and type B with different leadframe were analyzed with moisture sensitivity level 1 to observe delamination inside packages. The results showed that CTE of epoxy molding compound material type A is less CTE mismatch than that of epoxy molding compound material type B with both standard and roughness leadframe. Moreover, the results also found no delamination for epoxy molding compound material type A with roughened leadframe. In addition, both epoxy molding compound materials showed significant delamination inside packages with standard leadframe.

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Abstract. This research studied about an epoxy molding compound (EMC) floor life to reliability performance of integrated circuit (IC) package. Molding is the process for protecting the die of IC package form mechanical and chemical reaction from external environment by shaping EMC. From normal manufacturing process, the EMC is stored in the frozen at 5oC and left at around room temperature for aging time or floor life before molding process. The EMC floor life effect to its properties and reliability performance of IC package. Therefore, this work interested in varied the floor life of EMC before molding process to analyze properties of EMC such as spiral flow length, gelation time, and viscosity. In experiment, the floor life of EMC was varied to check the effect of its property to reliability performance. The EMC floor life were varied from 0 hours to 60 hours with a step of 12 hours and observed wire sweep, incomplete EMC, and delamination inside the packages for 3x3, 5x5 and 8x8 mm2 of QFN packages. The evaluation showed about clearly effect of EMC floor life to IC packaging reliability. EMC floor life is not any concern for EMC property, moldabilty, and reliability from 0 hours to 48 hours for molding process of 3x3,5x5 and 8x8 mm2 QFN packaging manufacturing

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