The additive manufacturing of electronic devices via inkjet printing presents a versatile alternative to the time and material consuming traditional lithographic techniques. Superfine inkjet (SIJ) printing is applied for the rapid prototyping of surface acoustic wave (SAW) devices. Using a commercial platinum ink, narrow conducting lines with about 3 times the bulk resistivity are created. We are the first to directly pattern interdigital transducers (IDTs) of about 10 μm width onto piezoelectric 128° YX LiNbO3 substrates at room temperature. Reflection and transmission curves are recorded. The observed resonance frequency of 95.6 MHz matches to the theoretical value of about 100 MHz for the device. We propose that the SIJ technology can produce IDTs of down to 1 μm width, venturing into the production of up to 1 GHz SAW devices.

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In this contribution we report the successful integration of a SiGe HBT module with fT = 300GHz, fmax = 480GHz in a 90nm BiCMOS technology platform. Building on previous studies by IHP and Infineon the Epitaxial-Base-Link process flow was further adapted for compatibility to the 90nm CMOS base technology.

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