A new dual image, aqueous developable photoresist can be processed to yield either positive or negative images that are crosslinked and thermally stable to temperatures >300°C. Positive images have similar resolution and processing parameters to conventional positive novolak resists. Negative resists from this system have a number of new and interesting properties that surpass the capabilities of their positive counterparts. In addition to producing highly resolved submicron images, thick coatings of resist can be used to form images with high aspect ratios. By adjusting the exposure of the resist, images with inward sloping wall profiles can be realized. As a result of the images being crosslinked and Insoluble in the resist coating solution, images can be recoated and new images formed over the top of existing patterns to form structures. A hypothetical mechanism that suggests that resist defects caused by dust on the mask or photoresist surface can be reduced In negative mode processing is also presented.

The x -ray lithographic performance of a new, experimental negative acting, single level resist has been investigated. Unlike other negative x -ray resists, which are solvent developed, the new resist is developed with aqueous base.This results in very low image swelling and allows high resolution, high aspect ratio, negative resist images to be obtained with a conventional palladium anode x -ray source of wavelength 4.37 A.

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