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This research investigates the carrier recombination properties of a crystalline defect layer introduced by the plasma enhanced chemical vapor deposition (PECVD) process of amorphous hydrogenated silicon nitride (SiNx) passivation films. A direct PECVD technique was used for SiNx films deposition. A crystalline defect layer existed on the surface of the silicon substrate and is under the SiNx passivation film. The recombination lifetime in this defect layer was obtained by focusing on the thickness of the defect layer and the effective lifetime before and after the defect layer etching. After etching a few nanometer thickness, effective lifetime drastically increased. On the other hands, the carrier recombination center could be electrically inactivated by 600°C annealing after SiNx deposition. According to the depth profile of effective lifetime, it was clarified the high carrier recombination region were concentrated near the surface of silicon substrate.

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