P-type doping of MoS2 has proved to be a significant bottleneck in the realization of fundamental devices such as p-n junction diodes and p-type transistors due to its intrinsic n-type behavior. We report a CMOS compatible, controllable and area selective phosphorus plasma immersion ion implantation (PIII) process for p-type doping of MoS2. Physical characterization using SIMS, AFM, XRD and Raman techniques was used to identify process conditions with reduced lattice defects as well as low surface damage and etching, 4X lower than previous plasma based doping reports for MoS2. A wide range of nondegenerate to degenerate p-type doping is demonstrated in MoS2 field effect transistors exhibiting dominant hole transport. Nearly ideal and air stable, lateral homogeneous p-n junction diodes with a gate-tunable rectification ratio as high as 2 × 10(4) are demonstrated using area selective doping. Comparison of XPS data from unimplanted and implanted MoS2 layers shows a shift of 0.67 eV toward lower binding energies for Mo and S peaks indicating p-type doping. First-principles calculations using density functional theory techniques confirm p-type doping due to charge transfer originating from substitutional as well as physisorbed phosphorus in top few layers of MoS2. Pre-existing sulfur vacancies are shown to enhance the doping level significantly.

Fe-doped ZnO nanocrystals are successfully synthesized and structurally characterized by using x-ray diffraction and transmission electron microscopy. Magnetization measurements on the same system reveal a ferromagnetic to paramagnetic transition temperature above 450 K with a low-temperature transition from the ferromagnetic to the spin-glass state due to canting of the disordered surface spins in the nanoparticle system. Local magnetic probes like electron paramagnetic resonance and Mössbauer spectroscopy indicate the presence of Fe in both valence states Fe 2+ and Fe 3+ . We argue that the presence of Fe 3+ is due to possible hole doping in the system by cation ͑Zn͒ vacancies. In a subsequent ab initio electronic structure calculation, the effects of defects ͑e.g., O and Zn vacancies͒ on the nature and origin of ferromagnetism are investigated for the Fe-doped ZnO system. Electronic structure calculations suggest hole doping ͑Zn vacancy͒ to be more effective to stabilize ferromagnetism in Fe-doped ZnO and our results are consistent with the experimental signature of hole doping in ferromagnetic Fe-doped ZnO samples.

We demonstrate a low and constant effective Schottky barrier height (ΦB ∼ 40 meV) irrespective of the metal work function by introducing an ultrathin TiO2 ALD interfacial layer between various metals (Ti, Ni, Au, and Pd) and MoS2. Transmission line method devices with and without the contact TiO2 interfacial layer on the same MoS2 flake demonstrate reduced (24×) contact resistance (RC) in the presence of TiO2. The insertion of TiO2 at the source-drain contact interface results in significant improvement in the on-current and field effect mobility (up to 10×). The reduction in RC and ΦB has been explained through interfacial doping of MoS2 and validated by first-principles calculations, which indicate metallic behavior of the TiO2-MoS2 interface. Consistent with DFT results of interfacial doping, X-ray photoelectron spectroscopy (XPS) data also exhibit a 0.5 eV shift toward higher binding energies for Mo 3d and S 2p peaks in the presence of TiO2, indicating Fermi level movement toward the conduction band (n-type doping). Ultraviolet photoelectron spectroscopy (UPS) further corroborates the interfacial doping model, as MoS2 flakes capped with ultrathin TiO2 exhibit a reduction of 0.3 eV in the effective work function. Finally, a systematic comparison of the impact of selective doping with the TiO2 layer under the source-drain metal relative to that on top of the MoS2 channel shows a larger benefit for transistor performance from the reduction in source-drain contact resistance.

X-ray diffraction studies on bulk amount of chemically prepared nanocrystalline powder of Zn1−xTMxO (TM=Co, Mn, Fe, and Ni) show that the evolution of secondary phases (Co3O4, Mn3O4, Fe3O4, or NiO) along with the single phase Zn1−xTMxO strongly depend on growth temperature and doping concentration. The highest solubility limits of Co, Mn, Fe, and Ni in ZnO are 30%, 30%, 20%, and 3% (atomic weight), respectively. The magnetization measurement shows that the secondary phase formation reduces the magnetization of single phase Zn1−xTMxO, which may be the important clue that the secondary phase is not responsible for magnetism in Zn1−xTMxO.

Monolayers of transition metal dichalcogenides (TMDCs) exhibit excellent electronic and optical properties. However, the performance of these two-dimensional (2D) devices are often limited by the large resistance offered by the metal contact interface. Till date, the carrier injection mechanism from metal to 2D TMDC layers remains unclear, with widely varying reports of Schottky barrier height (SBH) and contact resistance ( ), particularly in the monolayer limit. In this work, we use a combination of theory and experiments in Au and Ni contacted monolayer MoS2 device to conclude the following points: (i) the carriers are injected at the source contact through a cascade of two potential barriers -the barrier heights being determined by the degree of interaction between the metal and the TMDC layer; (ii) the conventional Richardson equation becomes invalid due to the multi-dimensional nature of the injection barriers, and using Bardeen-Tersoff theory, we derive the appropriate form of the Richardson equation that describes such composite barrier; (iii) we propose a novel transfer length method (TLM) based SBH extraction methodology, to reliably extract SBH by eliminating any confounding effect of temperature dependent channel resistance variation; (iv) we derive the Landauer limit of the contact resistance achievable in such devices. A comparison of the limits with the experimentally achieved contact resistance reveals plenty of room for technological improvements.