The electrical properties of silicon nitride/amorphous silicon structures were investigated using thin film transistors (TFTs) and metal insulator semiconductor (MIS) devices employing either a top nitride (TN) or bottom nitride (BN) as gate insulator. The density of states (DOS) deduced from the subthreshold transfer characteristic of the TFTs is one to two orders of magnitude higher than that obtained from quasistatic C(V) measurements on the MIS structures. This difference is discussed by considering the different thickness of the a‐Si:H layers of the two devices and the role of a fixed charge at the rear interface. Both techniques indicate a DOS in BN devices which is only slightly lower than in TN devices, by less than a factor of two. The measured field effect mobility of BN TFTs is about 70% higher. The differences in the measured field effect mobility for TN and BN configuration are discussed and ascribed to the source and drain parasitic resistances. The conclusion is verified by the fabrication of a TN TFT with a pure phosphine rear surface treatment, which exhibits performance comparable to BN TFTs.

International audienceSb2S3 is widely considered to be an attractive photovoltaic material based on abundant, nontoxic elements. However, the maximum efficiency reported for solar cells based on this semiconductor does not exceed 6.5%. We have measured light intensity-dependent J-V curves, transient microwave photoconductivity, steady-state photocurrent grating, modulated photocurrent, and photoconductivity on Sb2S3-based samples. All techniques converge toward the same observation: the main recombination route controlling the density of charge carriers in the absorber is of an order greater than one and appears to stem from an exponentially decaying density of tail states within the conduction band of the material. This conclusion has direct and drastic implications for the performance of Sb2S3-based solar cells