Here, we report a facile method to delaminate MXene (Ti 3 C 2 T x ) and prepare poly(vinylidene fluoride) (PVDF)/MXene composites by solution blending. Compared with neat PVDF, the PVDF composites with varying content of MXene (0-5 wt%) showed an enhancement in the PVDF thermal conductivity. In particular, when a loading of 5 wt% was attained, the thermal conductivity was increased to 0.363 W mK À1 , an approximate 1-fold enhancement compared with that of neat PVDF. In addition, MXene also exhibited a better performance in enhancing the thermal dynamic mechanical properties of PVDF. For instance, PVDF composites with only 5 wt% MXene exhibited a storage modulus as high as 7501 MPa, corresponding to a 64% enhancement compared with that of neat PVDF. In light of the excellent thermal properties of the PVDF/MXene composites, they can be expected to have a wide range of potential applications in thermal interfacial materials and structural components.

In this study, we report a facile approach to fabricate epoxy composite incorporated with silicon carbide nanowires (SiC NWs). The thermal conductivity of epoxy/SiC NWs composites was thoroughly investigated. The thermal conductivity of epoxy/SiC NWs composites with 3.0 wt% filler reached 0.449 Wm−1 K−1, approximately a 106% enhancement as compared to neat epoxy. In contrast, the same mass fraction of silicon carbide micron particles (SiC MPs) incorporated into epoxy matrix showed less improvement on thermal conduction properties. This is attributed to the formation of effective heat conduction pathways among SiC NWs as well as a strong interaction between the nanowires and epoxy matrix. In addition, the thermal properties of epoxy/SiC NWs composites were also improved. These results demonstrate that we developed a novel approach to enhance the thermal conductivity of the polymer composites which meet the requirement for the rapid development of the electronic devices.

Three dimensional graphene foam incorporated into epoxy matrix greatly enhance its thermal conductivity (up to 1.52 W mK−1) at low graphene foam loading (5.0 wt%), over an eight-fold enhancement in comparison with that of neat epoxy.