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Micro-conductive patterns formed by selective electroless Ni-B plating process were fabricated to investigate the vanous distribution of the seed layer on insulating substrates. Selective distribution of the seed layer was forming through successive steps of laser ablation, activation treatment, mechanical polishing. A KrF Excimer laser (wavelengh of 248nm) ablation was carried out on the PMMA (Polymethymethacrylate), PET (Polyethylene Terephalate), PC (Polycarbonate) and P1 (Polyimide) substrates. The UV-vis spectrometer analysis showed that PMMA was a weaker absorber than other polymers at the wavelength of 248 nm. The geometrical shape of structure formed is affected by absorption coefficient. Surface morphology and characteristics after laser ablation and electroless plating is observed by Field Emission Scanning Electro Microscope (FE-SEM). As a increasing the depth of substrate patterned by laser ablation, plating was precise. Finally, we concluded this method to be suited for manufacturing micro-conductive patterns on insulating substrates without lithography.

Pulsed UV laser beams, which are widely used in the processing of polymers, offer many advantages in the field of polymer production, primarily because their photon energy is higher than the binding energy of the polymer. In particular, the fabrication of polymers with an excimer laser process is faster and more convenient than with other processes. Nevertheless, some problems occur in the precision microprocessing of polymers, including the formation and deposition of surface debris, which is produced from the breakdown of either polymer chains or radical bonds. In the present work, a process for eliminating carbonized surface debris contamination generated by the laser ablation of a polymer was developed. The proposed approach for removing surface debris utilizes an erasable ink pasted on the polymer. The surface debris ejected from the polymer is then combined with the ink layer on the polymer. Finally, both the surface debris and the ink layer can be removed using adhesive tape.