Evidence is presented to show that the degradation of near-band-gap photoluminescence emission in GaAs with time of exposure to low power, cw laser excitation can be attributed to a surface mechanism that is independent of surface oxidation and may involve an interaction between crystal point defects and the photogenerated electron-hole plasma near the surface.

Device quality phosphorous (P) doped hydrogenated microcrystalline silicon (n+μc - Si:H) has been prepared by using the plasma enhanced chemical vapor deposition technique. The dependence of physical, chemical, structural and electrical properties on substrate temperature have been investigated. Conductivities for thick films up to 12 Ω−lcm−1 and 40 Ω−1cm−1 have been achieved for layers deposited at 300°C and 500°C, respectively. For films 50 nm thick deposited at 300°C a conductivity of about 5 Ω−1cm−1 has been obtained. A maximum average grain size around 30 nm was obtained. The etch rates of P-doped microcrystalline silicon have been found to be between 8 and 10 times higher than that of undoped hydrogenated amorphous silicon (a-Si:H) films deposited at the same temperature. Thin film transistors incorporating heavily P-doped amorphous and microcrystalline layer between source/drain metal and the a-Si:H channel have been fabricated. We show that an n+μc - Si:H source/drain contacts in thin film transistors provides very good characteristics, yielding an average effective field effect mobility, threshold voltage, and on/off current ratio of about 0.9cm2V−1 sec−1, below 4 V, and above 107, respectively.

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Device quality undoped hydrogenated microcrystalline silicon has been prepared by plasma enhanced chemical vapor deposition under different conditions. The dependence of physical, chemical, structural, and electrical properties on the deposition conditions has been investigated. Conductive (conductivity above 10−3Ω−1 cm−1) and resistive (conductivity around 10−9Ω−1cm−1) layers having approximately the same grain size, at a given substrate temperature, have been deposited between 200 and 500°C at two different hydrogen dilutions. Independently of the hydrogen dilution, the average grain sized is dependent on the deposition temperature and the film thickness; and a maximum average grain size of about 40 nm has been achieved for a thick film deposited at 500°C. The density of paramagnetic defects also increases with increasing deposition temperature, which indicates that more dangling bond defects are introduced as the total area of the grain boundaries increases. The etch rate decreases with increasing deposition temperature, and for the films deposited at 250 and 500°C the etch rate has been measured to be 6.6 and 2.7 nm/min, respectively. Thin film transistors incorporating a microcrystalline channel have been fabricated and evaluated. The best device had the following properties: field effect mobility, threshold voltage, and on/off current ratio of about 0.8 cm2/V sec, below 5 V, and around 106, respectively.