The use of Public-Private Partnerships (PPPs) to realize and operate public infrastructures is often associated with fiscal circumventing motivations. Using data at the municipal level, this paper investigates whether budget-constrained public authorities adopt PPPs in order to hide public debts. The results show that financial di culties often lead to a preference for PPPs instead of traditional forms of public procurement. However, this behavior is not explained by the possibility of debt hiding. We then discuss alternative explanations for these findings.
Cet article analyse les concepts d’abus d’exploitation et de dépendance économique, non seulement sous le prisme de la jurisprudence concurrentielle européenne mais également sous celui de l’économie industrielle. Bien que les racines théoriques de ces concepts reposent sur la théorie économique, ils ont été ignorés ou peu pris en compte dans le contexte de l’application du droit de la concurrence. Une approche fondée sur les effets ( effects-based ) devrait tenir compte de ces pratiques et pourrait fournir des indications sur la façon d’analyser leurs impacts. Nous nous appuyons sur deux exemples tirés des industries agro-alimentaires et de l’économie numérique. Le présent article souligne l’existence d’un paradoxe : bien que les modèles d’organisation industrielle fournissent des outils pertinents pour caractériser ces abus, évaluer leurs effets et concevoir des mesures correctives, ils demeurent peu utilisés dans la pratique décisionnelle. Classification JEL: K21, L12, L40, L42
Since the 2000s, several countries have established micro- and nanofabrication platforms for the research and education community as national projects. By combining such platforms with VLSI multichip foundry services, various integrated devices, referred to as “CMOS-MEMS”, can be realized without constructing an entire cleanroom. In this paper, we summarize MEMS-last postprocess schemes for CMOS devices on a bulk silicon wafer as well as on a silicon-on-insulator (SOI) wafer using an open-access cleanroom of the Nanotechnology Platform of MEXT Japan. The integration devices presented in this article are free-standing structures and postprocess isolated LSI devices. Postprocess issues are identified with their solutions, such as the reactive ion etching (RIE) lag for dry release and the impact of the deep RIE (DRIE) postprocess on transistor characteristics. Integration with nonsilicon materials is proposed as one of the future directions.
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