Window-leaved plants are succulent plants which possess areas of clear epidermis on their leaves. The underlying water storage tissue is transparent to allow light penetration to the internal chlorenchyma. The most highly evolved window-leaved plants with the most transparent tissue grow completely underground in desert regions. Only the rounded leaf tips are level with the soil surface and directly exposed to incident light. Light transmission curves were measured using live windows of five species of plants from three families (Liliaceae, Piperaceae, Mesembryanthemaceae). These results suggest that subterranean window leaves may be limited to a relatively short effective maximum length because of light absorption by the tissues involved. Scanning electron micrographs (SEM) of these plants show considerable differences in surface structure which may help to modulate incident light. Comparisons with related Mesembryanthemaceae illustrate that a complex series of adaptations have been developed to allow underground growth.

Electroless deposition of metals can be defined as the controlled autocatalytic reduction of a dissolved metal ion by a dissolved reducing agent at an interface to give a uniform film. The first electroless solutions were developed around 1840 for use in silver glass mirrors.

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Liquid‐Phase Metallizing Techniques Gas‐Phase Metallizing Techniques Vacuum‐Phase Metallizing Techniques Metallizing by Direct Physical or Thermal Bonding Environmental Concerns

Electroless plating is the controlled autocatalytic deposition of a continuous metallic film on a nonconductive or a metallic article. High purity chemicals are needed for the electroless coatings that are applied for both functional and decorative uses. Key application areas are multilayer and surface mount printed circuit boards, radio frequency interference shielding for computers, corrosion‐ and wear‐resistant metal surfaces, and lightweight plated plastics. The ability to produce metal deposits in controlled patterns makes electroless plating of primary importance to modern electronics technology. The most important electroless plating baths are copper and nickel‐phosphorus. Electroless gold, nickel‐boron, and composites of nickel having particles for higher wear resistance or greater lubricity are also commonly used. Aluminum, steel, copper, and other metals, as well as plastics, ceramics, glass, fibers, and composite materials, are all coated by means of electroless plating.