The results of a characterisation carried out on thick film resistors (TFRs) with dimensions reduced below the usual limits are reported in this paper. The test vehicle was a purpose‐designed test pattern with resistors whose dimensions reached a limit of 0·3 mm in length and 0·4 mm in width. The proposed aim of the work was to look for dimensional limits where TFRs could still give acceptable performances, though, if possible, keeping unchanged the materials system and the process conditions which are used in the authors' thick film hybrids facility.

The paper describes the results obtained by the integration of Polymer Thick Film and Printed Circuit Technologies. Polymer Thick Film (PTF) Technology, applied to PCB manufacturing, helps the designer's task considerably and offers an interesting way to achieve time and cost reduction. The use of conductive and dielectric materials to generate cross‐overs and low interconnection density multilayers on epoxy‐glass substrates is shown and basic design rules are discussed. The performances of PTF conductive materials from two different suppliers are investigated in terms of conductivity, current carrying capacity and contact resistance with the copper‐clad layer. Surface and bulk insulation resistance, capacitance, loss factor and breakdown voltage are studied for dielectric materials from two different suppliers. The effects of environmental tests, i.e., thermal shocks, high temperature storage and temperature‐humidity‐bias test, on the performances of dielectric and conductive PTF are investigated by means of suitable test patterns. Application examples of Transmission System boards are discussed in terms of design and manufacturing times and costs.