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A flexible and stretchable electronic device is an inevitable component to realize wearable and foldable display device. This requires high stability of backplane device operation on flexible substrate upon external mechanical stress such as bending, stretching, and other types of deformation induced stress. Because mechanical stress effects electrical characteristics and degrades the device performance, many researchers have studied the mechanical stress behavior of thin-film transistor devices on flexible substrates. In this work we present a process simulation model for non-linear deformation stress. We also demonstrate the validation of the model against publish data.