The imminent release of tissue atlases combining multichannel microscopy with single-cell sequencing and other omics data from normal and diseased specimens creates an urgent need for data and metadata standards to guide data deposition, curation and release. We describe a Minimum Information about Highly Multiplexed Tissue Imaging (MITI) standard that applies best practices developed for genomics and for other microscopy data to highly multiplexed tissue images and traditional histology.

HgCdTe offers significant advantages over other similar semiconductors, which has made it the most widely utilized variable-gap material in infrared (IR) focal plane array (FPA) technology. HgCdTe hybrid FPAs consisting of two-dimensional detector arrays that are hybridized to Si readout circuits (ROIC) are the dominant technology for second-generation infrared systems. However, one of the main limitations of the HgCdTe materials system has been the size of lattice-matched bulk CdZnTe substrates, used for epitaxially grown HgCdTe, which have been limited to 30 cm 2 in production. This size limitation does not adequately support the increasing demand for larger FPA formats which now require sizes up to 2048 3 2048, and only a single die can be printed per wafer. Heteroepitaxial Si-based substrates offer a cost-effective technology that can be scaled to large wafer sizes and further offer a thermalexpansion-matched hybrid structure that is suitable for large format FPAs. This paper presents data on molecular-beam epitaxy (MBE)-grown HgCdTe/Si wafers with much improved materials characteristics than previously reported. We will present data on 4-and 6-in diameter HgCdTe both with extremely uniform composition and extremely low defects. Large-diameter HgCdTe/Si with nearly perfect compositional uniformity and ultra low defect density is essential for meeting the demanding specifications of large format FPAs.

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Molecular beam epitaxy (MBE) growth of HgCdTe on large-size Si (211) and CdZnTe (211)B substrates is critical to meet the demands of extremely uniform and highly functional third-generation infrared (IR) focal-panel arrays (FPAs). We have described here the importance of wafer maps of HgCdTe thickness, composition, and the macrodefects across the wafer not only to qualify material properties against design specifications but also to diagnose and classify the MBE-growth-related issues on large-area wafers. The paper presents HgCdTe growth with exceptionally uniform composition and thickness and record low macrodefect density on large Si wafers up to 6-in in diameter for the detection of short-wave (SW), mid-wave (MW), and long-wave (LW) IR radiation. We have also proposed a cost-effective approach to use the growth of HgCdTe on low-cost Si substrates to isolate the growth-and substrate-related problems that one occasionally comes across with the CdZnTe substrates and tune the growth parameters such as growth rate, cutoff wavelength (k cutoff ) and doping parameters before proceeding with the growth on costly large-area CdZnTe substrates. In this way, we demonstrated HgCdTe growth on large CdZnTe substrates of size 7 cm · 7 cm with excellent uniformity and low macrodefect density.

This paper presents the status of HgCdTe growth on large-area Si and CdZnTe substrates at Raytheon Vision Systems (RVS). The different technological tools that were used to scale up the growth from 4 inch to 6 inch diameter on Si and from 4 cm 9 4 cm to 8 cm 9 8 cm on CdZnTe without sacrificing the quality of the layers are described. Extremely high compositional uniformity and low macrodefect density were achieved for single-and two-color HgCdTe layers on both Si and CdZnTe substrates. Finally, a few examples of detector and focal-plane array results are included to highlight the importance of high compositional uniformity and uniformly low macrodefect density of the epitaxial layers in obtaining high operability and low cluster outages in single-and two-color focal-plane arrays (FPAs).