A novel flexible encapsulation method (Flex Lami-capsulation) is reported, which can be applied in the roll-to-roll process for mass production of organic electronic devices. Flex Lami-capsulation is very simple, fast, and getter-free, and is as effective as glass encapsulation. Use of this method is feasible in large-area flexible displays and does not have the drawbacks of conventional encapsulation methods.

An implicit finite element model was developed to analyze the deformation behavior of low carbon steel during phase transformation. The finite element model was coupled hierarchically with a phase field model that could simulate the kinetics and micro-structural evolution during the austenite-to-ferrite transformation of low carbon steel. Thermo-elastic-plastic constitutive equations for each phase were adopted to confirm the transformation plasticity due to the weaker phase yielding that was proposed by Greenwood and Johnson. From the simulations under various possible plastic properties of each phase, a more quantitative understanding of the origin of transformation plasticity was attempted by a comparison with the experimental observation.

A novel flexible‐encapsulation method (Flex Lami‐capsulation), which laminates a simple metal foil/rubbery polymer bilayer on flexible devices, is reported on page 4308 by T.‐W. Lee and co‐workers. Flex Lami‐capsulation can be applied to the roll‐to‐roll process for mass production of flexible electronic devices, and overcomes the drawbacks of conventional rigid glass and thin‐film encapsulation methods.

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