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The use of fluorine (F2) lasers, emitting at 1 57 nm, offers new possibilities for key applications demanding very high resolution (e.g. microlithography for chip production) and/or higher photon energy to expand the laser-processable material spectrum (e.g. nanotechnology). Promising results have been achieved using F2 lasers at 1 57 nm for micromachining of various materials that are very difficult to process at other laser wavelengths.This paper reports about new F2 laser source developments and their efficiency in processing Teflon®/Polytetrafluoroethylene (PTFE) and fused silica under moderate, uniform illumination conditions. Ablation rates and threshold parameters have been investigated. Scanning electron micrographs of the produced microstructures are presented.

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