Abstract-Chip-scale photonic interconnection networks have emerged as a promising technology solution that can address many of the scalability challenges facing the communication networks in next-generation high-performance multicore processors. Photonic interconnects can offer significantly higher bandwidth density, lower latencies, and better energy efficiency. Even though photonics exhibits these inherent advantages over electronics, the network designs that can successfully leverage these benefits cannot be straightforwardly extracted from typical electronic network methodologies and must consider the many unique physical-layer constraints of optical technologies. We conduct an architectural exploration of four chip-scale photonic interconnection networks in a novel simulation environment, measuring insertion loss, crosstalk, and power. We also explain and demonstrate the impact of these physical-layer metrics on the scalability, performance, and realizability of each design.

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We describe and demonstrate the use of a feedback control system to thermally stabilize a silicon microring modulator subjected to a thermally volatile environment. Furthermore, we establish power monitoring as an effective and appropriate mechanism to infer the temperature drift of a microring modulator. Our demonstration shows that a high-performance silicon microring-based device, normally inoperable in thermally volatile environments, can maintain error-free performance when a feedback control system is implemented.

Abstract-Photonic technology is becoming an increasingly attractive solution to the problems facing today's electronic chip-scale interconnection networks. Recent progress in silicon photonics research has enabled the demonstration of all the necessary optical building blocks for creating extremely highbandwidth density and energy-efficient links for on-chip and off-chip communications. From the feasibility and architecture perspective however, photonics represents a dramatic paradigm shift from traditional electronic network designs due to fundamental differences in how electronics and photonics function and behave. As a result of these differences, new modeling and analysis methods must be employed in order to properly realize a functional photonic chip-scale interconnect design. In this paper, we present a methodology for characterizing and modeling fundamental photonic building blocks which can subsequently be combined to form full photonic network architectures. We also describe a set of tools which can be utilized to assess the physical-layer and system-level performance properties of a photonic network. The models and tools are integrated in a novel open-source design and simulation environment. We present a case study of two different photonic networks-on-chip to demonstrate how our improved understanding and modeling of the physical-layer details of photonic communications can be used to better understand the system-level performance impact.Index Terms-Optical communications, optical crosstalk, optical losses, photonic interconnection networks, simulation software, system analysis and design.

Integrated photonics has been slated as a revolutionary technology with the potential to mitigate the many challenges associated with on-and off-chip electrical interconnection networks. To date, all proposed chipscale photonic interconnects have been based on the crystalline silicon platform for CMOS-compatible fabrication. However, maintaining CMOS compatibility does not preclude the use of other CMOS-compatible silicon materials such as silicon nitride and polycrystalline silicon. In this work, we investigate utilizing devices based on these deposited materials to design photonic networks with multiple layers of photonic devices. We apply rigorous device optimization and insertion loss analysis on various network architectures, demonstrating that multilayer photonic networks can exhibit dramatically lower total insertion loss, enabling unprecedented bandwidth scalability. We show that significant improvements in waveguide propagation and waveguide crossing insertion losses resulting from using these materials enables the realization of topologies that were previously not feasible using only the single-layer crystalline silicon approaches.