Hard amorphous silicon carbonitride coatings for wear resistance have been produced by d.c. plasma‐enhanced chemical vapour deposition on pure iron at 573 K. Compared with most plasma assisted processes work was conducted under a relatively high pressure of 130 Pa. The advantages of this technique are an amorphous film structure, high deposition rates (up to 2 μm/min), high hardness and simple equipment. Hexamethyldisilazan (HMDSN) was used as precursor and argon, hydrogen, nitrogen and ammonia as process gases. The dependence of the coatings on the process parameters (process gas and d.c. power) was investigated. The characterization of the samples was carried out mainly by Fourier transform infrared spectrometry (FTIR), electron probe microanalysis (EPMA) and hardness measurement. Samples show clearly the infrared spectra absorption bands characteristic of SiC and Si3N4, with traces of hydrogen bonding. The material structure shows a strong dependence on the process gas and the d.c. power. However, for argon and hydrogen were deposited carbon‐rich SiC films with low nitrogen content. Nitridic films with low carbon content were deposited using nitrogen and especially ammonia. The hardness of the produced coatings was about 10 ‐ 55 GPa.

Hard BCN films were deposited by chemical vapour deposition (CVD) on Si(100) substrates. TCVD (thermal activated) and PECVD (GD or RF microwave plasma-activated, respectively) were used. The films were analysed with respect to chemical state, composition, morphology and microstructure, oxidation behaviour and hardness. Wavelength dispersive X-ray spectroscopy (EPMA), infrared spectroscopy (IR), transmission electron microscopy (TEM), differential thermal analysis (DTA) and hardness evaluation were employed for film characterization. A correlation between deposition parameters and film composition, structure and hardness could be proved in every CVD process. Parallels between TCVD and PECVD films emerged in the case of chemical composition and the correlation between carbon content and hardness values. Considerable differences exist with regard to the microstructure, especially the texture of the films. Moreover in TCVD films the carbon is preferentially incorporated between the BN basal planes, whereas in PECVD films it is incorporated preferentially in as well as between the BN basal planes.

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