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The latest advances in MEMS technology have enabled the design of a new generation of electronic microsystems products. These systems may combine numerous analog/mixed signal microelectronics blocks and MEMS functions on a single chip or on two or more chips assembled within an integrated package. As designers have begun to use CAD tools to insert MEMS into these new products, additional requirements and constraints on the tools are emerging. As the MEMS designs move from prototypes to manufacturing production new CAD issues emerge.Some ofthese design tool needs are:. The design flow must be streamlined and integrated, avoiding feature duplication among CAD tools . The tools must move from the analysis realm to the design realm.. The tools must address IP creation and design re-use for product design to be cost effective . The tools must be foundry ready and address manufacturing variations and reliability issues . Modeling continues to be a key issue in microsystem design. This paper will present extensions to our integrated solution for the development of Micro Electro Mechanical Systems (MEMS) that combines aspects of electronic design automation with mechanical, thermal, and fluidic computer-aided design. Based on our experience in applying these tools to real world problems and observing previous generations of CAD tool usage, we have adapted our design methodology and created an enhanced tool suite.

This paper presents a fully integrated solution for the development of Micro Electro Mechanical Systems which covers component libraries, design tools and designs methodologies which are used in conjunction with conventional design automation tools. This solution enables system houses in wireless and optical communications and consumers electronics markets to reduce their internal development costs and significantly accelerate their product development cycle

This paper presents a fully integrated solution for the development of Micro Electro Mechanical Systems (MEMS) which covers component libraries, design tools and design methodologies which are used in conjunction with conventional design automation tools (EDA). This solution enables system houses in wireless and optical communications and consumer electronics markets to reduce their internal development costs and significantly accelerate their product development cyc1es.

In addition to pressu re senso rs for engine cont rol and accelerometers for airbag sys tems , yaw rate sensors and gyros are foreseen as a recent automo tive challen ge fo r MEMS based components . Such devic es , when using co riolis forces as a sensing prin ciple , lead to extremely complex sys tem design . Th e moving structure has to be rotationally exc ited and tightly co ntrolled . Th en , the structure tilt , indu ced by the co riolis force, has to be sim ultaneo usly measur ed . The simultaneo us sensi ng and actuation can, in theor y quit e easily be created with capacitive electro-mechanical struc tures and switched-capacitor based sig nal con ditioning circuits. But in practice, the strong interactions between the two pa rts of the device makes such a system extremely difficult to understand , ana lyse and ultimately, to successfully design . Al so, produ cts using these device s may combine num erous analog/mixe d sig nal microelectronics blocks and MEMS functions on a single chip o r on two or mo re chips asse mbled within an integrated package , complicating the analysis . This paper will demonstrat e a design methodology and tools that enable mechanical and electronic engineers to efficie ntly model, sim ulate and design such syste ms . This int egrated solution for the developm ent of Micro Electro Mechanical Systems (MEMS ) combines aspec ts of electronic design automation wi th mechanical , the rma l, and f1 uidic computeraided design , and allows the complex interactions and multiph ysical beha viour of automotive senso rs to be captured and analyzed.In the tools, system design ers create a mixed technology schematic using build ing blocks. Each of these bricks encapsulates a behav iour al model , w ritten in HDL-A S.