&lt;title&gt;Moving from analysis to design: a MEMS CAD tool evolution&lt;/title&gt;

Liateni, Karim; Lee, Hee Jung; Perez-Maher, Mary Ann; Karam, J.M.

doi:10.1117/12.382287

Cited by 3 publications

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“…In MEMS each kind of design information does not have unified format, this has affected enormously the sharing and exchange of different kinds of information in MEMS design process. Literatures [1] also indicate: a major difficulty in designing MEMS systems resides in the lack of information sharing between designers from different disciplines for example among system designers, IC designers, process engineers, and MEMS experts. Sharing and exchange information between MEMS design stage become a bottleneck question of MEMS design.…”

Section: Introductionmentioning

confidence: 99%

Product Information Model of MEMS

Yan

2011

AMR

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A lot of information needs to be processed in the MEMS design process, but this information lack the unified expression format at present. This causes the design stage of MEMS not to be able to share information, furthermore causes low design efficiency. A product information model is presented according to MEMS design stage. XML language is used to describe information of each design stage, and an information exchange and sharing platform model has been established to solve MEMS design data sharing and exchange bottleneck question. The XML technology makes the platform reusable and extensible.

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Section: Introductionmentioning

confidence: 99%

Product Information Model of MEMS

Yan

2011

AMR

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Intrinsic Strain Modeling and Residual Stress Analysis for Thin-Film Processing of Layered Structures

Nejhad

Pan

Feng

2003

Journal of Electronic Packaging

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Residual stresses develop due to intrinsic and extrinsic strains that form during the processing. Extrinsic strains can be determined using coefficient of thermal expansion, material properties, and processing conditions. An “Equivalent Reference Temperature (ERT)” technique is described and used to model and evaluate the intrinsic strains. piezoelectric microelectromechanical systems (P-MEMS) are considered in this work. Laminate theory with three-dimensional state of stress and strain is used to evaluate residual stresses using the ERT model. In finite element analysis (FEA), the residual stresses and strains of multi-layer P-MEMS structures deposited layer-by-layer during processing, are simulated using the “element birth-and-death” approach. The evaluated residual stresses for a simplified geometry using ANSYS three-dimensional FEA and analytical analysis employing three-dimensional laminate theory are presented along with their corresponding experimental results. A user-friendly software based on the 3-D laminate theory is developed and installed on the Internet. The “equivalent reference temperature” as well as residual stresses and strains can be determined using this software. The level of residual stresses and strains of P-MEMS depend upon various factors such as geometrical design, material selection, and process conditions.

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Integrated Multidisciplinary Design and Optimization Methodologies in Electronics Packaging: State-of-the-Art Review

Suwa

Hadim

2006

Heat Transfer, Volume 3

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Electronic packaging design is a process that requires optimized solutions based on multidisciplinary design tradeoffs, which usually have complicated relations among multiple design variables. Required numerical analyses such as thermal and thermo-mechanical have hampered this multidisciplinary optimization process because of their time intensive modeling and computation time. This paper presents a state-of-the-art overview of recent multidisciplinary design and optimization methodologies in electronics packaging. The reported methodologies are divided into tow groups: (1) integrated multidisciplinary CAD environment, and (2) automated design and optimization techniques. A semi-automated design environment, which includes graphical user interface, modeling, and simulation, enhances the design procedure in the first group. Fully automated design optimization methodologies are used for various design applications in the second group. In recent years, methodologies using (1) detailed numerical analysis models directly connected to optimization algorithms, (2) design of experiments (DoE), and (3) artificial neural networks (ANNs) have been proposed as new trends in this field. Advantages as well as disadvantages of these methods are discussed.

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<title>Moving from analysis to design: a MEMS CAD tool evolution</title>

Cited by 3 publications

References 0 publications

Product Information Model of MEMS

Product Information Model of MEMS

Intrinsic Strain Modeling and Residual Stress Analysis for Thin-Film Processing of Layered Structures

Integrated Multidisciplinary Design and Optimization Methodologies in Electronics Packaging: State-of-the-Art Review

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