The drive for miniaturization of electronic packaging is continuing relentlessly due to ever more functionality in smaller, lighter mobile products. Consequently, innovations are required in packaging technology, and more importantly, in enabled volume manufacturing. Some recent trends in thin products and packaging will be high-lighted and compared to the JEDEC standards for packages. The ASE roadmaps for package size reductions will be presented with particular focus on prepreg based substrate technology. A single sided substrate has been developed and is currently shipping in high volume. The manufacturing concept for this substrate has been adapted to build coreless substrates based on prepreg which are currently in characterization. Further adaptation has led to embedded component, actives and passives, substrates which are currently in qualification. For the later, a new manufacturing form factor has been chosen to take advantage of the assembly infrastructure and to maximize the yield of the substrate which is a key factor for the commercial success of this technology. ASE is offering these substrates in full turnkey service from wafer sort to bumping to embedding in the substrate to assembly of top components, balling and final test.

The development in communication handheld devices has pushed the demand for packages with high level of functionality and complexity at the same time smaller package outline and decreased package thickness. Embedding active dies and/or passive components into the substrate is fulfilling these integration requirements, but embedding can have further beneficial effects (electrical performance, thermal dissipation, shielding) that deliver more benefit for embedding (1). Whereas embedding dies in substrates seems a simple concept, it can come with strong advantages as found in the described case for Power Modules in terms of electrical performance and thermal dissipation. In this paper we shall report the development of embedded technologies for Power Modules and compare electrical performance, thermal dissipation and reliability results with other Power Module package types. We shall report on an intelligent power module for server applications up to 1.5kW consisting of a driver IC and 2 MOSFETs using embedded die in substrate technology in high volume manufacturing. We will describe the development of next generation embedding technologies for Power Modules, their expected benefits and respective application targets together with simulation results. We conclude with a brief overview of the challenges that come with embedded packaging supply chain.

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