Sub-5nm all-around gate FinFETs with 3nm fin width were fabricated for the first time. The n-channel FinFET of sub-5nm with 1.4nm HfO 2 shows an I Dsat of 497µA/µm at V G =V D =1.0V. Characteristics of sub-5nm transistor are verified by using 3-D simulations as well as analytical models. A threshold voltage increases as the fin width reduces by quantum confinement effects. The threshold voltage shift was fitted to a theoretical model with consideration of the first-order perturbation theory. And a channel orientation effect, based on a current-flow direction, is shown. Key words: all-around gate, FinFET, sub-5nm, quantum effect Introduction Silicon-based transistors are scaled down continually in order to increase a density and speed. Multi-gate FinFETs have strengths of high robustness on short-channel effects (SCEs) and superior scalability using conventional processes [1][2][3][4][5][6][7]. However, the ultimate minimum feature-sized device operating at room temperature has been expected to be 1.5nm according to Heisenberg's uncertainty principle and Shannon-von NeumannLandauer expression [8]. The fabricated sub-5nm all-around gate (AAG) FinFET is approaching to this fundamental limit. FinFET [7]. For ultimately scaled transistor, AAG FinFET is known to be the best structure to provide scalability and flexibility in device design [9]. This work primarily focuses on feasibility and scalability of sub-5nm AAG FinFET. A threshold voltage shift by quantum confinement and an effect of current-flow direction are reported.Fabrications Fig. 1 illustrates a process flow of AAG FinFET. As a starting material, (100) SOI wafers were used. 100nm silicon film was thinned down to 14nm by using thermal oxidations and HF wet etch. Dual-resist process for a fin and a gate patterning was used to define nanometer features by e-beam lithography and non-critical large-area patterns by optical lithography. After the silicon-fin etch, a sacrificial oxide was grown and removed to alleviate etching damages. Gate dielectrics were split into 1.4nm HfO 2 by atomic layer deposition and 2nm thermal SiO 2 . Reasonable characteristics of sub-5nm devices were achieved in HfO 2 group. 30nm in-situ n + poly-silicon was deposited for the gate electrode. The gate was patterned by the dual-resist process, similarly. After the gate and spacer formation, arsenic ions were implanted to form the source and drain (S/D). 1000℃ spike annealing was utilized to activate the dopants of S/D. Finally, forming gas annealing at 450℃ was applied. Metallization was skipped for iterative annealing to optimize gate-to-S/D overlap. The fabricated device dimensions are sub-5nm gate length (L G ), averaged 3nm fin width (W Fin ), and 14nm fin height (H Fin ).Results and Discussions Fig. 2 shows a SEM top-view of 3nm silicon-fin and sub-5nm gate. Fig. 3 and Fig. 4 show TEM cross-sectional views of 3nm silicon-fin (a-a' direction of Fig. 6 and Fig. 7. An on-state current is 497µA/µm at V G =V D =1.0V in Fig. 6, which is normalized by allarounded channel perime...

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