Argon and carbon ion bombardment of p-diamond at 500–5000 eV in ultrahigh vacuum were studied by in situ x-ray photoelectron spectroscopy (XPS) and low energy electron diffraction analysis. Both argon and carbon ion bombardment at room temperature in the present energy range created a defective surface layer. The radiation damage was manifested by the introduction of a distinct C 1s peak (referred to as the ‘‘defect’’ peak later) with a binding energy about 1 eV less than that of the bulklike diamond peak, and by the introduction of some additional filled states (referred to as the ‘‘filled states’’) near the valence band edge of diamond. It was found that in comparison to argon bombardment, carbon bombardment was more efficient in producing the filled states but less efficient in raising the C 1s defect peak. While the filled states disappeared by annealing at about 500 °C, the C 1s defect peak did not change much even with a 1000 °C anneal. These results suggest that the C 1s defect peak, which has also been observed on reconstructed diamond surfaces after hydrogen desorption [see, e.g., B. B. Pate, Surf. Sci. 165, 83(1986)], is associated with vacancy formation and aggregation which give some ‘‘internal surfaces’’ with a behavior like a reconstructed atomically clean diamond surface. The filled states introduced by ion bombardment are associated with interstitials or interstitial clusters. The amount of residual defects was found to increase with both an increasing bombardment dose and energy. For an argon bombardment at 1000 eV to a dose of 5×1014/cm2, the defective layer was estimated to be about 1.5 nm. Further, it was found that the radiation damage, particularly the ‘‘vacancy defects’’, could only be annealed (at 1000 °C) when the dose was below 5×1014/cm2 at a bombardment energy of 500 eV. XPS band bending analyses also showed that room temperature bombardment induced a small reduction (0.2 eV) of the surface Fermi level position (EFs) on the p-diamond. However, subsequent vacuum annealing caused a rather large increase of EFs. But the EFs data from about 20 bombarded and annealed samples were always less than 2.2 eV. Thus the formation of an n-type diamond was not observed.

Argon incorporation in Si(100) by low energy ion bombardment has been studied by polar angle dependent x-ray photoelectron spectroscopy and Rutherford backscattering spectroscopy. The bombardment was performed at 15, 20, and 100 eV in an ultrahigh vacuum chamber where a mass-separated argon ion beam with an energy spread of less than 1 eV was directed to the target. Both the argon penetration depth and incorporation probability were found to increase with bombardment energy. With a fluence of 2×1017/cm2, most of the incorporated argon was located within 20 Å of the target surface for the 100 eV bombardment and within 10 Å for the 15 eV bombardment. In all cases, the argon depth distribution reached a maximum and then declined. At this fluence, the incorporation probabilities were 0.0015 and 0.0004 for the 100 and 15 eV bombardment, respectively. When the amount of incorporated argon was measured as a function of fluence, it increased with fluence at low fluences, reached a quasisaturation at about 1×1016/cm2, but became fluence dependent again above 1×1018/cm2. The retained argon was stable at room temperature but showed at least two stages of thermal desorption in the temperature range 25–500 °C.

Changes in surface-band bending of both boron-doped and phosphorus-doped silicon (100) samples by exposure (40 s) to hydrofluoric acid (HF) with varying HF concentrations were studied by x-ray photoelectron spectroscopy. Effects of subsequent thermal annealing was investigated by in situ heating in vacuum. Hydrogen termination of the dangling bonds on silicon was found to be an effective means to reduce surface gap states on silicon. Near-flatband surfaces were observed on both n- and p-Si by the HF exposure when the doping concentration was not less than 1×1016/cm3, and when the HF concentration was not higher than 5%. A higher HF concentration promoted hydrogen diffusion and the formation of an H-B species in p-Si. As such, band bending increased on p-Si. However, the deactivation of boron could be recovered by annealing for less than 1 h at a temperature as low a 120 °C.

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GaAs metal insulator semiconductor capacitors and high transconductance metal insulator semiconductor field effect transistorsPassivation of both cleaved GaAs͑110͒ facets and wafers ͑both n and p types͒ was performed with different surface treatments including HF-etch of native oxide, passivation with an ammonium sulfide solution, passivation with hydrogen polysulfide, and passivation with a Si/S, Ge/S, or Si/Ge/S interface control layer. The interface state density was measured with capacitance-voltage ͑CV͒ measurements of metal-insulator-semiconductor capacitors fabricated on the passivated surfaces using remote plasma deposited silicon nitride as gate insulator. The interface structures of the capacitors were analyzed by x-ray absorption near-edge structure spectroscopy and x-ray photoemission spectroscopy. It was found that, while the passivation procedures with the sulfur compounds or a Si/S interface control layer did improve the CV data when compared with the HF oxide etch, the Si/Ge/S multilayer passivation technique led to the best CV results. By comparing the quasistatic and high frequency ͑1 MHz͒ CV data, we found that the minimum interface state density of the fabricated capacitors was about 10 12 eV Ϫ1 cm Ϫ2 . The results were compared with those obtained from GaAs͑100͒ and the difference was addressed with respect to the surface geometry and the electronic structures.