Hitherto, two distinct families of multielement detector arrays have been used for infrared ͑IR͒ imaging system applications: linear arrays for scanning systems ͑first generation͒ and two-dimensional arrays for staring systems ͑second generation͒. Nowadays, third-generation IR systems are being developed which, in the common understanding, provide enhanced capabilities such as larger numbers of pixels, higher frame rates, better thermal resolution, multicolor functionality, and/or other on-chip signal-processing functions. In this paper, fundamental and technological issues associated with the development and exploitation of third-generation IR photon detectors are discussed. In this class of detectors the two main competitors, HgCdTe photodiodes and quantum-well photoconductors, are considered. This is followed by discussions focused on the most recently developed focal plane arrays based on type-II strained-layer superlattices and quantum dot IR photodetectors. The main challenges facing multicolor devices are concerned with complicated device structures, thicker and multilayer material growth, and more difficult device fabrication, especially for large array sizes and/or small pixel dimensions. This paper also presents and discusses the ongoing detector technology challenges that are being addressed in order to develop third-generation infrared photodetector arrays.

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We present an improved quantitative mobility spectrum analysis (i-QMSA) procedure for determining free electron and hole densities and mobilities from magnetic-field-dependent Hall and resistivity measurements on bulk or layered semiconductor samples. The i-QMSA technique is based on a fundamentally new approach, which optimizes the fit to the conductivity tensor components and their slopes by making those adjustments in the mobility spectra that result in the greatest error reduction. Empirical procedures for manipulating the mobility spectra are also introduced, with the dual purpose of reducing the error of the fit and simplifying the shape of the spectra to minimize the presence of unphysical artifacts. A fully automated computer implementation of the improved QMSA is applied to representative synthetic and real data sets involving various semiconductor material systems. These results show that, as compared with previous approaches, the presented algorithm maximizes the information that may be extracted from a given data set, and is suitable for use as a standard tool in the characterization of semiconductor material and device transport properties.

Suvorova, A.; Lawn, B. R.; Liu, Y.; Hu, X. Z.; Dell, J. M.; and Faraone, L., "Effect of deposition conditions on mechanical properties of low-temperature PECVD silicon nitride films" (2006 AbstractThe effect of deposition conditions on characteristic mechanical properties -elastic modulus and hardness -of low-temperature PECVD silicon nitrides is investigated using nanoindentation. It is found that increase in substrate temperature, increase in plasma power and decrease in chamber gas pressure all result in increases in elastic modulus and hardness. Strong correlations between the mechanical properties and film density are demonstrated. The silicon nitride density in turn is shown to be related to the chemical composition of the films, particularly the silicon/nitrogen ratio.