A well-defined insulating layer is of primary importance in the fabrication of passive (e.g. capacitors) and active (e.g. transistors) components in integrated circuits. One of the most widely known 2-Dimensional (2D) dielectric materials is hexagonal boron nitride (hBN).Solution-based techniques are cost-effective and allow simple methods to be used for device fabrication. In particular, inkjet printing is a low-cost, non-contact approach, which also allows for device design flexibility, produces no material wastage and offers compatibility with almost any surface of interest, including flexible substrates.In this work we use water-based and biocompatible graphene and hBN inks to fabricate all-2D material and inkjet-printed capacitors. We demonstrate an areal capacitance of 2.0 ± 0.3 nF cm -2 for a dielectric thickness of ~3 µm and negligible leakage currents, averaged across more than 100 devices. This gives rise to a derived dielectric constant of 6.1 ± 1.7. The inkjet printed hBN dielectric has a breakdown field of 1.9 ± 0.3 MV cm -1 . Fully printed capacitors with sub-µm hBN layer thicknesses have also been demonstrated. The capacitors are then exploited in two fully printed demonstrators: a resistor-capacitor (RC) low-pass filter and a graphene-based field effect transistor.

Paper is the ideal substrate for the development of flexible and environmentally sustainable ubiquitous electronic systems, which, combined with two-dimensional materials, could be exploited in many Internet-of-Things applications, ranging from wearable electronics to smart packaging. Here we report high-performance MoS 2 field-effect transistors on paper fabricated with a "channel array" approach, combining the advantages of two large-area techniques: chemical vapor deposition and inkjet-printing. The first allows the pre-deposition of a pattern of MoS 2 ; the second, the printing of dielectric layers, contacts, and connections to complete transistors and circuits fabrication. Average I ON /I OFF of 8 × 10 3 (up to 5 × 10 4) and mobility of 5.5 cm 2 V −1 s −1 (up to 26 cm 2 V −1 s −1) are obtained. Fully functional integrated circuits of digital and analog building blocks, such as logic gates and current mirrors, are demonstrated, highlighting the potential of this approach for ubiquitous electronics on paper.

Inkjet printed graphene is in-depth investigated by means of Hall mobility measurements, low-temperature magnetoresistance analysis, and low frequency noise characterization.

Complementary electronics has represented the corner stone of the digital era, and silicon technology has enabled this accomplishment. At the dawn of the flexible and wearable electronics age, the seek for new materials enabling the integration of complementary metal-oxide semiconductor (CMOS) technology on flexible substrates, finds in low-dimensional materials (either 1D or 2D) extraordinary candidates. Here, we show that the main building blocks for digital electronics can be obtained by exploiting 2D materials like molybdenum disulfide, hexagonal boron nitride and 1D materials such as carbon nanotubes through the inkjet-printing technique. In particular, we show that the proposed approach enables the fabrication of logic gates and a basic sequential network on a flexible substrate such as paper, with a performance already comparable with mainstream organic technology.