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Microlithography uses a variety of resists and polymer materials to create patterns and lithographic structures on several types of substrates. Excellent adhesion of the resists and polymers to the substrate is a prerequisite for successful patterning and pattern transfer. This paper presents the results of an investigation of the effects of an adhesion promoter, SurPass, on the lithographic process when used in combination with a variety of resists, and substrate materials. SurPass is a waterborne, non-hazardous, cationic organic surface active agent that promotes adhesion by modifying the substrate surface energy without deposition, chemical change or impact on electrical properties of the substrate material. The effectiveness of SurPass in combination with several novolac and epoxy resists on various substrate materials will be presented.