Objective: we aimed to reflect on the Actor-Network Theory as a theoretical-methodological framework in health and nursing research.Method: reflexive study, in which principles and concepts of the Actor-Network Theory were used as a theoretical-methodological framework.Results: the Theory can be put in practice based on the mapping of controversies as its method, defined by the following movements: 1) seeking an entry door in the network; 2) identifying the spokespersons; 3) accessing the inscription devices; 4) mapping the associations between the actants. It corresponds to a set of techniques to explore and visualize polemics and controversies, observing and mapping the social debate, especially, but not exclusively, addressing technical-scientific problems. Hence, in the scope of health and nursing, more precisely in the sphere of the complex practices where the nurses and health technologies operate, the Actor-Network Theory has emerged as a relevant and noteworthy theoretical-methodological framework. Its application can contribute to the understanding of the innovations and their influences for the group, based on associations established between the actors, following their steps without fractioning their lives, without taking isolated excerpts, following what happens in a network and what is interlinked, interfering and suffering interference.Conclusion: in the belief that knowledge is a social product or effect of a network of human and non-human actors, instead of something produced by operating a privileged scientific method, the Actor-Network Theory figures as a promising theoretical-methodological framework for the controversial environments of health and nursing. DESCRIPTORS: Nursing research. Methodology. Social theory. Social network. A TEORIA ATOR-REDE COMO REFERENCIAL TEÓRICO-METODOLÓGICO EM PESQUISAS EM SAÚDE E ENFERMAGEM RESUMOObjetivo: refletir sobre a Teoria Ator-Rede como referencial teórico-metodológico na pesquisa em saúde e enfermagem.Método: estudo do tipo reflexivo, que utilizou os princípios e conceitos da Teoria Ator-Rede como referencial teórico-metodológico.Resultados: a referida Teoria pode ser operacionalizada a partir da cartografia de controvérsias como seu método, sendo este definido pelos movimentos: 1) buscar uma porta de entrada na rede; 2) identificar os porta-vozes; 3) acessar os dispositivos de inscrição; 4) mapear as associações entre os actantes. Constitui-se como um conjunto de técnicas para explorar e visualizar polêmicas e controvérsias, observando e cartografando o debate social, especialmente, mas não exclusivamente, em torno dos problemas técnico-científicos. Assim, no escopo da saúde e enfermagem, mais precisamente no ambiente de práticas complexas, onde os enfermeiros e as tecnologias da saúde operam, a Teoria AtorRede tem emergido como um referencial teórico-metodológico de relevante notoriedade. Sua aplicação pode contribuir para o entendimento das inovações e suas influências para a coletividade a partir de associações estabelecidas entre os atores, ...

Permanent adhesive wafer bonding is a mature technology as it provides the advantages of a low thermal budget process and is less sensitive to the quality of the bonding surfaces. One of the most used materials for this process is Benzocyclobutene (BCB). Due to its usage the material was further developed for bonding applications. In this work we report the fabrication of ultrathin BCB bonding layers (down to 25 nm thickness) by means of spray coating. The advantages of such bonding layers are both technical (e.g. no substrates shift due to adhesive layer flow during bond process) or and economical (significantly lower material consumption compared to spin coating). The fabrication and characterization of such bonding layers is presented and bonding results are presented.

ID Number: 476) Current Fan Out Wafer Level Packaging (FOWLP) technology, eWLB, has limited heat dissipation capability, as the materials used in, namely the epoxy mold compound (EMC), originally aimed process ability and mechanical stability, but not heat conduction. As eWLB technology expands to WLSiP (Wafer Level System-in-Package) for very high system integration density, combining multiple chips and different components in the same package, the thermal performance becomes a critical factor. In a broader scope, the improvement of its heat dissipation capabilities opens eWLB technology platform also to power applications.A specific difficulty for all encapsulated packages is that the EMC must be electrical insulator, which places challenges both on heat conduction and on reliable mechanical bonding to a usually metallic heat spreader or integrated heat sink. Good heat conductors are, generally, electrical conductors and cannot be used as encapsulate materials. The EMC's are typically organic resins highly loaded with inorganic fillers, but high performance thermal interface material (TIM) are design for metal-metal interfaces, not for organic-metal as required.The paper describes the developments and results achieved towards a Power-eWLB demonstrator, using NANIUM's eWLB technology know-how and manufacturing capabilities. This demonstrator aims the improvement of thermal dissipation capabilities of a typical-size eWLB package, by using novel materials, adhesives and assembly processes suitable for high-volume production. It starts from baseline thermal characterization of eWLB package and the selected measurements methods; discusses the selected materials and techniques for the coupling of the WLSiP body to a heat spreader; and defines the 8mm x 8mm WLSiP capable of multi-pattern heating and dissipating up to 14W.The work done is part of the collaborative European FP7-ICT project NANOTHERM (Innovative Nano-and Micro Technologies for Advanced Thermo and Mechanical Interfaces), together with a consortium of leading IDM, OEM, OSAT, material suppliers and academic/ institutes. 978-1-4799-8609-5/15/$31.00 ©2015 IEEE

The increasing demand for high performance devices with increased functionality onto a single device/package and with reduced form factor were the main factors driving the development of heterogeneous integration technology. Heterogeneous integration (HI) refers to the assembly and packaging of multiple separately manufactured components onto a single chip in order to increase functionality. Components with different functionality, substrate materials and process technologies are joined in a single package in a System in Package (SIP) approach. The functionality of the components could vary throughout the entire device supply chain starting from signal processors to memory, micro-electro-mechanical systems (MEMS) and silicon photonics. The possibility to join multiple functionalities onto a die enables new packaging architectures and design concepts. One such concept is based on the not new concept of die-to-wafer bonding but allows for bonding multiple dies to a wafer in a single process. Such technological approach requires a reliable local multiple-dies bonding technology compliant also to state of the art optical alignment accuracy. Packaging is the final manufacturing process transforming devices into functional products for the end user. Packaging must provide electrical and photonic connections for signal input and output, power input, and voltage control. It also provides for thermal dissipation and the physical protection required for increased product reliability. In this work we report results using a method and process flow enabling local die bonding compatible with the highest alignment accuracy and cleaning requirements to support a very high yield. A customized temporary carrier with alignment features was utilized to place known good dies (KGD) on the carrier and enable die processing prior to the final bonding process. Such carriers with KGD’s (figure 1) were successfully processed using direct bonding, hybrid bonding, adhesive bonding and metal bonding using as bonding partner different substrate materials like silicon and III-V semiconductor. The process success was verified by the final transfer rate, scanning acoustic microscope imaging and TEM cross section analysis (figure 2). In addition other metrology methods have been identified to monitor the process stability. Figure 1

The increasing demand for high performance devices with increased functionality onto a single device/package and with reduced form factor were the main factors driving the development of heterogeneous integration technology. Heterogeneous integration (HI) refers to the assembly and packaging of multiple separately manufactured components onto a single chip in order to increase functionality. Components with different functionality, substrate materials, and process technologies are joined in a single package in a System in Package (SIP) approach. The functionality of the components could vary throughout the entire device supply chain starting from signal processors to memory, micro-electro-mechanical systems (MEMS), and silicon photonics. The possibility to join multiple functionalities onto a die enables new packaging architectures and design concepts. One such concept is based on the not new concept of die-to-wafer bonding but allows for bonding multiple dies to a wafer in a single process. Packaging is the final manufacturing process transforming devices into functional products for the end user. Packaging must provide electrical and photonic connections for signal input and output, power input, and voltage control. It also provides for thermal dissipation and the physical protection required for increased product reliability. In this work, we report results using a method and process flow enabling local die bonding compatible with the highest alignment accuracy and cleaning requirements to support a very high yield. A customized temporary carrier with alignment features was utilized to place known good dies (KGD) on the carrier and enable die processing prior to the final bonding process.