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Esterification of 2,2‐bis(3,5‐dimethylpyrazol‐1‐yl)‐3‐hydroxypropionic acid (2) with methacryloyl chloride led to the new κ3‐N,N,O ligand 2,2‐bis(3,5‐dimethylpyrazol‐1‐yl)‐3‐methacrylato‐propionic acid (Hbdmpzmp) (3). The κ3‐N,N,O coordination as known from bis(3,5‐dimethylpyrazol‐1‐yl)acetic acid (Hbdmpza, 1) was proven by syntheses of the complexes [Mn(bdmpzmp)(CO)3] (4) and [Re(bdmpzmp)(CO)3] (5) and the single‐crystal X‐ray structure of 4. The methacrylic ester functionality makes 3, 4 and 5 suitable for polymerisation. Thus, copolymerisation of 3 with methyl methacrylate (MMA), a combination of MMA and ethylene glycol dimethacrylate (EGDMA) or pure EGDMA led to various solid phases (P1a–P1c, P2, P3a, P3b) with incorporated ligand. Polymer‐bound manganese and rhenium tricarbonyl complexes could be obtained by copolymerisation of 4 and 5 with MMA as well as by a polymer analogous reaction of P1a with appropriate metal salts. In both cases, the facial tripodal binding behaviour was evidenced by IR spectra of the polymer supported transition metal complexes and the uptake of manganese was proven by AAS measurements. Reaction of the soluble deprotonated solid phase P1a with copper(II) chloride led to a deep‐blue solid phase (P‐Cu‐I). The UV/Vis absorption maximum at 715 nm indicates the copper centres to act as crosslinking agent by a similar binding behaviour as in [Cu(bdmpza)2]. In contrast, the heterogeneous reaction of P1b with copper(II) chloride formed a lime‐green solid phase (P‐Cu‐II). The bathochromic shift of the absorption maximum by 78 nm suggests one‐sided bound copper centres. EPR spectra do not show exchange narrowing between the copper centres indicating the metal centres to be far enough apart from each other to prevent magnetic interactions. (© Wiley‐VCH Verlag GmbH & Co. KGaA, 69451 Weinheim, Germany, 2008)

Different analytical procedures were developed to investigate the chemical composition of printed wiring boards. A set of 11 samples from different electronic devices were ground and prepared for ICP-AES and AAS analyses by extraction with aqua regia and microwave digestion. Several sample preparation techniques were used for the analyses by EDXRF; the best results were obtained by embedding the samples in Vaseline. Since no standard reference material is available for printed wiring boards, a model reference material was created to compare the applicability and limitations of the employed analytical techniques.

The new N,N,O ligand bis(3,5-dimethyl-4-vinylpyrazol-1-yl)-acetic acid (Hbdmvpza) (4) suitable for copolymerisation was synthesised in a multi-step synthesis starting from bis(3,5-dimethylpyrazol-1-yl)methane (1). The