This work demonstrated a process for the atomic-scale etching of SiO2 films, consisting of alternating nanometer-thick fluorocarbon film deposition with O2 plasma irradiation in a capacitively coupled plasma reactor. Ar plasma etching after fluorocarbon film deposition tends to suffer from nanometer- or subnanometer-thick carbon films deposited on the SiO2 surface and chamber walls. These carbon films cause various problems, such as reductions in the etching rate per cycle and degradation of the SiO2 quality. In contrast, in our two-step process, O2 plasma removes carbon atoms in such fluorocarbon films. This process therefore allows the atomic scale etching of SiO2 films without any residue or surface contamination. Additionally, since the etching rate per cycle plateaus as both the etching time and deposition time are extended, it is unnecessary to uniformly deposit a fluorocarbon film over the wafer.

Highly efficient, low-loss, and compact InP/InGaAsP polarization converter based on a half-ridge waveguide structure is fabricated and demonstrated experimentally. The device is fabricated by a simple self-aligned process and integrated with a ridge InP waveguide. Using a 150-μm-long device, we obtain the mode conversion of more than 96% and the on-chip loss of less than 1.0 dB over the broad wavelength range from 1510 to 1575 nm. The experimental results are explained quantitatively using the full-vector eigenmode calculation, which also reveals large fabrication tolerance of the demonstrated device.

A photonic integrated circuit capable of 1x100 switching is reported. The switch, incorporating more than 250 photonic components along with numerous passive waveguides and bends, demonstrates power penalty < 1 dB at 10 Gbps and extinction ratio > 50 dB.

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