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In-situ deployment of sensors and actuators enables both adaptive engine control and distributed engine control concepts. Currently, there exists a small but increasing pool of commercial electronics components to facilitate these advanced control concepts. As hightemperature operable electronics become more broadly available, electronics packaging must be designed to endure high temperatures, large acceleration loads, and support nonplanar installation. A multi-chip module packaging process is being systematically developed by the authors to yield a packaging methodology that meets or exceeds the environmental constraints of current high-temperature (HT) electronics components. NomenclatureDEC = distributed engine control dB = decibel dBi = decibel isotropic EM = electromagnetic g = acceleration due to gravity (9.81 m/s 2 ) HT = high-temperature Hz = hertz IC = Integrated Circuit JFET = junction gate field-effect transistor kHz = kilohertz MCM = multi-chip module MOSFET = metal-oxide-semiconductor field-effect transistor OEM = original equipment manufacturer psi = per square inch RF = radio frequency RFID = radio frequency identification RPM = revolutions per minute SAW = surface acoustic wave SOI = silicon on insulator SiC = silicon carbide TBC = thermal barrier coating °C = degrees centigrade 1 Vice President, , 515 Courtney Way -Suite B, Regular Member.