One of the main challenges to exploit molybdenum disulfide (MoS) potentialities for the next-generation complementary metal oxide semiconductor (CMOS) technology is the realization of p-type or ambipolar field-effect transistors (FETs). Hole transport in MoS FETs is typically hampered by the high Schottky barrier height (SBH) for holes at source/drain contacts, due to the Fermi level pinning close to the conduction band. In this work, we show that the SBH of multilayer MoS surface can be tailored at nanoscale using soft O plasma treatments. The morphological, chemical, and electrical modifications of MoS surface under different plasma conditions were investigated by several microscopic and spectroscopic characterization techniques, including X-ray photoelectron spectroscopy (XPS), atomic force microscopy (AFM), conductive AFM (CAFM), aberration-corrected scanning transmission electron microscopy (STEM), and electron energy loss spectroscopy (EELS). Nanoscale current-voltage mapping by CAFM showed that the SBH maps can be conveniently tuned starting from a narrow SBH distribution (from 0.2 to 0.3 eV) in the case of pristine MoS to a broader distribution (from 0.2 to 0.8 eV) after 600 s O plasma treatment, which allows both electron and hole injection. This lateral inhomogeneity in the electrical properties was associated with variations of the incorporated oxygen concentration in the MoS multilayer surface, as shown by STEM/EELS analyses and confirmed by ab initio density functional theory (DFT) calculations. Back-gated multilayer MoS FETs, fabricated by self-aligned deposition of source/drain contacts in the O plasma functionalized areas, exhibit ambipolar current transport with on/off current ratio I/I ≈ 10 and field-effect mobilities of 11.5 and 7.2 cm V s for electrons and holes, respectively. The electrical behavior of these novel ambipolar devices is discussed in terms of the peculiar current injection mechanisms in the O plasma functionalized MoS surface.

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Semitransparent perovskite solar cells (ST‐PSCs) are highly attractive for applications in building‐integrated photovoltaics as well as in multijunction tandem devices. To fabricate high‐performance ST‐PSCs, suitable transparent top electrodes are strongly needed. Dielectric/metal/dielectric (DMD) multilayer structures have been shown to be promising candidates, though generally based on high‐value metals such as gold or silver, the latter causing also stability issues by reacting with perovskite. Here, a novel DMD transparent electrode based on nonprecious, less‐reactive copper is developed via thermal evaporation and used as a top anode in the fabrication of high‐performance semitransparent n‐i‐p perovskite solar cells, the best device yielding a power conversion efficiency as high as 12.5%. The DMD architecture consists of a gold‐seeded Cu thin film sandwiched between two MoO x dielectric layers. It is demonstrated that Cu self‐aggregation and diffusion into MoOx can be substantially limited by introducing an ultrathin (1.5 nm) Au seed layer, and conductive Cu films as thin as 9.5 nm can be achieved. A fine tuning of the perovskite layer thickness is also carried out to further enhance the device transparency up to a maximum average visible transmittance approaching 25%.

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