No abstract

No abstract

Through implementation of the 3-D tri-gate topology, GaN-based high-electron mobility transistors (HEMTs) have been fabricated and high-frequency performances as well as the short-channel effects are investigated. The designed tri-gate transistors are highly-scaled having 100 nm of gate length, which introduces the condition of a short channel. It is demonstrated that higher sub-threshold slopes, reduced drain-induced barrier lowering and better overall off-state performances have been achieved by the nano-channel tri-gate HEMTs with an AlGaN barrier. A lattice-matched InAlGaN barrier with the help of the fin-shaped nano-channels provide improved gate control, increasing current densities, and transconductance g m . In a direct comparison, very high drain current densities (∼3.8 A/mm) and g m (∼550 mS/mm) have further been obtained by employing a pure AlN barrier.INDEX TERMS High-electron mobility transistor (HEMT), fin-shaped field-effect transistor (FinFET), Gallium nitride, short channel.

No abstract

AlGaN/GaN high-electron mobility transistors (HEMTs) with varied Tri-gate topologies have been fabricated and influences of the fin-shaped nano-channels on device parasitics are examined. Through S-parameter measurements and modelling of the designed Fin-FETs, a detailed RF investigation on intrinsic device parameters is performed under different biasing schemes. Corresponding RF performances and transfer characteristics as well as the derived small-signal parameters of the measured devices are extracted by employing 3-D EM FET model analysis at 110 GHz. Comparisons between the designed fin-geometries and intrinsic device parameters have proven flatter gm, gds and fT responses, which are presented through experimental results in detail for the first time