The stratum corneum is the outermost skin layer that obstructs the delivery of active ingredients found in cosmeceutical products. Chemical peels and microbeads have been used to overcome this layer, but these methods can cause side effects and are not environmentally friendly. While microneedles do not share the dangers mentioned above, they are currently only available as patches, which makes them unsuitable to be used with products that are usually applied onto a large area of the skin surface. Therefore, the aim of this study was to develop microneedle-like particles (MLP) whose needles would disrupt the skin during the rubbing process. A modified approach taken from conventional micromolding techniques was used to make the MLPs. The experimental results show that the fabricated structures had the required mechanical strength. Furthermore, after the application of the MLPs, the permeability of two fluorescent dyes, fluorescein sodium salt and sulforhodamine B increased to 217.6% ± 25.6% and 251.7% ± 12.8% respectively. Additionally, the permeability of a model drug, niacinamide, was shown to have increased to 193.8% ± 29.9%. Cryosectioned porcine slices also confirmed the ability of MLPs to enhance skin permeability by revealing a deeper penetration of the applied fluorescent dye. Altogether, the results demonstrate the potential of MLPs to be used as safe skin permeability enhancers that can be applied all over the skin.
As pattern size is shrinking, required mask CD specification is tighter and it's effect on wafer patterning is more severe. Recent study showed that the effect of mask local CD variation of mask on wafer is much smaller than that of global CD variation.[1] To enhance the device performance, wafer CD uniformity should be enhanced and controlled by mask global CD uniformity. Mask global CD uniformity usually can be enhanced by mask process and optimal fogging effect correction. To enhance the mask global CD uniformity on mask, resist process and FEC (Fogging Effect Correction), reliable CD measurement tool and methods are necessary. Recently, group CD using OCD(Spectroscopic Ellipsometer) or AIMS(Aerial Image Measurement and Simulation) or polynomial fitting method is introduced to represent global CD variation on mask.[2][3][4] These methods are removing local CD variation on mask. The local CD variation will be remained as residual CD after approximation. In this paper, local CD variation of mask and wafer is evaluated and 2 kinds of methods are used to measure CD on mask and wafer, and the correlation of global CD of mask and field CD of wafer are evaluated. And the repeatability of field to field CD uniformity of wafer is evaluated to correct the fields CD uniformity of wafer by controlling the selective changing of transmittance of mask or to feed back to mask process. Higher correlation between fields of wafer, more accurate correction can be possible.
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