Smooth, high quality N-polar GaN films were realized by metal organic chemical vapor deposition (MOCVD) through growth on misoriented (0001) sapphire substrates and the development of a high temperature nucleation process. Misorientation angles from 0.5° to 4° toward the a and the m plane of the sapphire substrate were investigated. Whereas GaN films grown on substrates with a misorientation angle of only 0.5° or 1° exhibited high densities of hexagonal surface features as commonly observed for N-polar GaN films grown by MOCVD, smooth GaN layers were obtained on sapphire substrates with misorientation angles of 2° or larger. In addition, the structural and optical properties of the GaN films significantly improved with increasing misorientation angle, as evaluated by high resolution x-ray diffraction, atomic force microscopy, transmission electron microscopy, and photoluminescence measurements. The properties of GaN layers grown on (0001) sapphire with a misorientation of 4° were comparable to Ga-polar GaN films grown in the same reactor.

Progress in metal-organic chemical vapor deposition of high quality ( ) 0001 ¯N-polar (Al, Ga, In)N films on sapphire, silicon carbide and silicon substrates is reviewed with focus on key process components such as utilization of vicinal substrates, conditions ensuring a high surface mobility of species participating in the growth process, and low impurity incorporation. The high quality of the fabricated films enabled the demonstration of N-polar (Al, Ga, In)N based devices with excellent performance for transistor applications. Challenges related to the growth of high quality N-polar InGaN films are also presented.

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Raman and photoluminescence characterization of focused ion beam patterned InGaN/GaN multi-quantum-wells nanopillar arrayEffects of growth interruption on the optical and the structural properties of InGaN/GaN quantum wells grown by metalorganic chemical vapor deposition GaN nanopillar and nanostripe arrays with embedded InGaN / GaN multi-quantum wells ͑MQWs͒ were fabricated by holographic lithography and subsequent reactive ion etching. Etch related damage of the nanostructures was successfully healed through annealing in NH 3 /N 2 mixtures under optimized conditions. The nanopatterned samples exhibited enhanced luminescence in comparison to the planar wafers. X-ray reciprocal space maps recorded around the asymmetric ͑1015͒ reflection revealed that the MQWs in both nanopillars and nanostripes relaxed after nanopatterning and adopted a larger in-plane lattice constant than the underlying GaN layer. The pillar relaxation process had no measurable effect on the Stokes shift typically observed in MQWs on c-plane GaN, as evaluated by excitation power dependent photoluminescence ͑PL͒ measurements. Angular-resolved PL measurements revealed the extraction of guided modes from the nanopillar arrays.

This paper reviews the progress of N-polar (000 1) GaN high frequency electronics that aims at addressing the device scaling challenges faced by GaN high electron mobility transistors (HEMTs) for radio-frequency and mixed-signal applications. Device quality (Al, In, Ga)N materials for N-polar heterostructures are developed using molecular beam epitaxy and metalorganic chemical vapor deposition. The principles of polarization engineering for designing N-polar HEMT structures will be outlined. The performance, scaling behavior and challenges of microwave power devices as well as highly-scaled depletion-and enhancement-mode devices employing advanced technologies including self-aligned processes, n+ (In,Ga)N ohmic contact regrowth and high aspect ratio T-gates will be discussed. Recent research results on integrating N-polar GaN with Si for prospective novel applications will also be summarized.