This paper presents two novel measurement methods to characterize silicon carbide (SiC) MOSFET devices. The resulting data are utilized to significantly improve the extraction of a custom device model that can now accurately reproduce device switching behavior. First, we consider the I d −V ds output characteristics of power devices such as SiC transistors. These are typically measured using traditional curve tracers, but the characterization of the high-voltage and high-current (HVHC) region is very challenging because of device power compliance and self-heating. In this paper, we introduce a measurement technique that overcomes self-heating and derives the HVHC region from switching waveforms. The switching transient characteristics of devices are used to determine drain current (I d ) as a function of drain-source voltage (V ds ) in the HVHC range. Second, we consider another challenging characterization area: measurement of nonlinear capacitances when device is turned on. These capacitance characteristics of on-state devices are important for correcting disagreements between simulations and measurements in turn-off switching transient waveforms and cannot be measured using a conventional capacitance-voltage meter. We introduce S-parameter measurements as an effective method to obtain the capacitance characteristics of both off-state devices and on-state devices. These novel measurement techniques have been applied to the modeling of a SiC device. The extracted device model, a modified version of the popular Angelov−GaN high-electron-mobility transistor model, shows significant improvement in terms of the accuracy of switching waveforms of devices over a wide range of operating conditions.

Continuous-wave operation at room-temperature has been demonstrated for InGaN multi-quantum-well (MQW) laser diodes (LDs) grown on low-dislocation-density n-GaN substrates with a backside n-contact. The current, current density and voltage at the lasing threshold were 144 mA, 10.9 kA/cm2 and 10.5 V, respectively, for a 3 µm wide ridge-geometry diode with high-reflection dielectric coated mirrors. Single-transverse-mode emission was observed in the far-field pattern of the LDs and the beam full width at half power in the parallel and perpendicular directions was 6° and 25°, respectively.

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Homoepitaxial growth on a 6H-SiC (0001)Si face was carried out successfully at 1500°C by chemical vapor deposition. This temperature is 300°C lower than typical well-known growth temperatures. The p-n junction diodes were fabricated with the grown layers and showed very good rectification. The breakdown electric field was estimated to be 2.4×106 V/cm using the characteristics of the p-n junction diodes. This value is comparable with high-temperature grown layers. The fabricated p-n junction diodes showed blue light emission in the forward-biased region.