We describe a new and unique method for simultaneous determination of the groove depth and duty cycle of binary diffraction gratings. For a near-normal angle of incidence, the +1 and -1 diffracted orders will behave nearly the same as the duty cycle is varied for a fixed grating depth. The difference in their behavior, quantified as the ratio of their respective diffraction efficiencies, is compared to a look-up table generated by rigorous coupled-wave theory, and the duty cycle of the grating is thus obtained as a function of grating depth. Performing the same analysis for the orthogonal probe-light polarization results in a different functional dependence of the duty cycle on the grating depth. By use of both TE and TM polarizations, the depth and duty cycle for the grating are obtained by the intersection of the functions generated by the individual polarizations. These measurements can also be used to assess qualitatively both the uniformity of the grating and the symmetry of the grating profile. Comparison with scanning electron microscope images shows excellent agreement. This method is advantageous since it can be carried out rapidly, is accurate and repeatable, does not damage the sample, and uses low-cost, commonly available equipment. Since this method consists of only four fixed simple measurements, it is highly suitable for quality control in a manufacturing environment.

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We have developed a novel class ofprojection lithography systems that provide both high-throughput resist patterning and dielectric via formation for production ofa variety ofelecironic modules, including flat-panel displays (FPD's), multichip modules (MCM's), printed circuit boards (PCB's), and microelectromechanical systems (MEMS). The new technology eliminates limitations of current lithography tools, including contact and proximity tools, conventional projection systems, steppers and scanners, and direct-write machines. Further, the new system concept is highly modular, thereby providing equipment upgradability as well as choice ofuser-specified system configurations. These results are achieved with a novel, hexagonal seamless scanning concept and a single-planar stage system configuration that provide both high optical and scanning efficiencies, and combine high-resolution imaging with very large exposure area capability. We describe the new technology and present experimental results. These lithography systems are highly attractive for cost-effective production of microelectronic products with feature sizes ranging from 15 xm to below 1 jtm and substrate sizes ranging from 1 50 x 150 mm to larger than 610 x 660 mm. -We have developed a novel class of projection lithography systems that provide both high-throughput, high-resolution resist patterning and dielectric via formation for fabrication of 0277-786X198/$1O.QO SPIE Vol. 3331 / 197 Downloaded From: http://proceedings.spiedigitallibrary.org/ on 05/14/2015 Terms of Use: http://spiedl.org/terms

Precision collimators and collimator arrays are increasingly critical components as telecommunication networks increase in bandwidth. In this paper we describe the collimator fabrication process at Corning Rochester Photonics Corporation. We describe replicated and etched collimator arrays and illustrate packaging concepts. Metrology and optical performance data is presented for both individual and arrayed collimators. Microlens surfaces etched into fused silica with surfaces sags of greater than 70 tim, surface finishes better than 30 A rms are presented. Collimator arrays with pointing errors less than 40 iRad, and microlens focal length uniformity error less than +1-0.5% have been fabricated and the data presented.