The thickness of thin films determines the films’ unique properties, due to which they are widely used in optics and electronics. To measure the thickness of films in the range of 1 nm — 1 mcm during film deposition or on a finished product, it is important that non-destructive measurement methods should be used. An analysis of the most commonly used non-destructive methods for measuring and controlling the thickness of thin films is performed, with a possibility of in situ control of the technological process as well as for testing of finished products. This work describes theoretical and practical considerations of using reflection high-energy electron diffraction, piezoelectricity, interferometry and gravimetric methods for thin film thickness measurements. The results of the study can be used for selecting an optimal method of obtaining thin films when conducting theoretical and applied research.

Here we have studied and estimated the indices of the military personnel thermal state and pieces of military clothes both common and according to body areas (head, arm (shoulder and forearm) hands, hips, lower legs, feet) per unit of clothes area for selection and estimation of materials and structure of the outfit which shall provide the given thermal resistance. The cooling physiological limits and their endpoints were determined, taking into account the discomfort limitation based on warmth sense modalities. Functional indices of the military personnel are determined by the hypothermia criteria. The cold sense modalities of the body were determined based on the calculation of the heat deficit index.

Thin film technologies are widely used in science and industry and have a critical value for optics and electronics. Special properties of thin films are related to their thickness, usually ranging between 1 nm and 1 um. Measuring such a thickness is a challenging task, always concomitant with the stage of technology development. When using witness samples and specimen control groups, destructive methods can be employed to measure the thickness of the deposited layers. An analysis of the most commonly used destructive methods of measuring the thickness of thin films is conducted, the results of which can be used for selecting a suitable method when planning corresponding experiments. This work describes theoretical and practical considerations of using bevel cut method, spherical cut method, atomic force microscopy and stylus profilometry for measuring thin film thickness.

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